SCHEMBL11272755

SCHEMBL11272755

NC(=O)c1ccc(C(=O)Oc2ccccc2)cc1

nearest known ligand 0.89

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP10 Q53GL7 5/20 0.89
TMPRSS15 P98073 2/20 0.67
PRSS1 P07477 2/20 0.67
ACR P10323 1/20 0.67
HGFAC Q04756 1/20 0.62
MAPT P10636 5/20 0.58
TDP1 Q9NUW8 2/20 0.58
L3MBTL1 Q9Y468 2/20 0.58
POLB P06746 1/20 0.58
CYP3A4 P08684 1/20 0.58
PARP1 P09874 1/20 0.58
TSHR P16473 1/20 0.58
CYP2C19 P33261 1/20 0.58
RECQL P46063 1/20 0.58
BLM P54132 1/20 0.58
PMP22 Q01453 1/20 0.58
HSD17B10 Q99714 1/20 0.58
NSD2 O96028 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.54
F2 P00734 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23486305 0.94 PARP10 (1.00) PARP10TMPRSS15PRSS1ACRHGFAC
SCHEMBL70034 0.89 PARP10 (0.70) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL8205435 0.85 PARP10 (0.78) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL31888 0.85 PARP10 (0.70) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL1870544 0.85 PARP10 (0.70) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL5330655 0.85 PARP10 (0.66) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL451331 0.84 PARP10 (0.65) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL29051941 0.84 PARP10 (0.65) PARP10TMPRSS15PRSS1ACRMAPT
SCHEMBL68278 0.83 PARP10 (0.63) PARP10TMPRSS15PRSS1ACRMAPT
Terephthalic Acid SCHEMBL28437942 0.83 PARP10 (0.63) PARP10TMPRSS15PRSS1ACRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4309473-A Non-tacky strand prepreg comprising a resin composition containing a combination of (1) a thermosetting resin and (2) a high molecular weight epoxy resin and a process for forming an article from the same TOHO BESLON CO., LTD. (JP) 1982-01-05 US disclosed