⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6762722 | 0.88 | — | — | |
| SCHEMBL13403138 | 0.82 | — | — | |
| SCHEMBL15356253 | 0.76 | TSHR (0.31) | — | |
| SCHEMBL16808762 | 0.76 | TSHR (0.31) | — | |
| SCHEMBL2571985 | 0.72 | ALDH1A1 (0.34) | — | |
| SCHEMBL14613573 | 0.71 | — | — | |
| SCHEMBL15356257 | 0.71 | MAPT (0.44) | — | |
| SCHEMBL3219541 | 0.71 | TSHR (0.31) | — | |
| SCHEMBL13135727 | 0.70 | TSHR (0.32) | — | |
| SCHEMBL15356256 | 0.70 | TSHR (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 332 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10654982-B2 | Method for preparing polarizer protecting film | LG CHEM, LTD. (KR) | 2020-05-19 | — | — | US | claimed |
| EP-2655528-B1 | BICOMPONENT REACTIVE INK FOR INK JET PRINTING | SICPA HOLDING SA (CH) | 2015-02-11 | — | — | EP | claimed |
| WO-2012123403-A1 | EPOXY RESIN SYSTEM WITH VISUAL MONITORING OF THE HARDENING STATE | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. (DE) | 2012-09-20 | — | — | WO | claimed |
| EP-1893702-B1 | CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM | SABIC INNOVATIVE PLASTICS IP (NL) | 2011-07-20 | — | — | EP | claimed |
| US-7622514-B2 | curable formualtion containing a functionalized colloidal silica obtained from the reaction of surface hydroxyl groups of colloidal silica with at least one functionalizing silane, an acryalate monomer, a epoxy resin or polyepoxide, acrylate with epoxy functionality, a curing agent ( photoinitiators) | SABIC INNOVATIVE PLASTICS IP B.V. (NL) | 2009-11-24 | — | — | US | claimed |
| US-20080160317-A1 | Optoelectronic device | GELCORE LLC | 2008-07-03 | — | — | US | claimed |
| EP-1899423-A1 | CURABLE COMPOSITION AND ARTICLE POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM | Momentive Performance Materials Inc. (US) | 2008-03-19 | — | — | EP | claimed |
| EP-1893702-A1 | CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM | Momentive Performance Materials Inc. (US) | 2008-03-05 | — | — | EP | claimed |
| US-20080001140-A1 | Optoelectronic device | GELCORE LLC | 2008-01-03 | — | — | US | claimed |
| WO-2006121603-A1 | CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2006-11-16 | — | — | WO | claimed |
| US-20040030048-A1 | Heterotelechelic polyolefin polymer adducts with epoxides | FMC CORPORATION | 2004-02-12 | — | — | US | claimed |
| US-20030236388-A1 | Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation | GENERAL ELECTRIC COMPANY | 2003-12-25 | — | — | US | claimed |
| US-20030208009-A1 | A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation | YEAGER GARY WILLIAM (US) | 2003-11-06 | — | — | US | claimed |
| US-20030208008-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | RUBINSZTAJN MALGORZATA IWONA (US) | 2003-11-06 | — | — | US | claimed |
| US-6617401-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | claimed |
| US-6617400-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | claimed |
| US-20030071368-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | claimed |
| US-20030071367-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | claimed |
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | claimed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | claimed |