⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11517007 | 0.73 | GSK3B (0.35) | — | |
| SCHEMBL1004361 | 0.73 | — | — | |
| SCHEMBL22721610 | 0.67 | — | — | |
| SCHEMBL11771451 | 0.65 | GABRA1 (0.32) | — | |
| SCHEMBL2872291 | 0.63 | — | — | |
| SCHEMBL9998971 | 0.62 | — | — | |
| SCHEMBL16405689 | 0.60 | NOS3 (0.31) | — | |
| SCHEMBL168554 | 0.60 | GRIN2D (0.36) | — | |
| SCHEMBL9344582 | 0.60 | KDM4E (0.30) | — | |
| SCHEMBL11056488 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122095314-A | Photosensitive resin laminate, method for forming resist pattern, and method for manufacturing wiring board having conductor pattern | — | 2026-05-26 | — | — | CN | disclosed |
| CN-117916082-B | Laminate and method for producing laminate | 富士胶片株式会社 | 2026-05-15 | — | — | CN | disclosed |
| WO-2026100708-A1 | PHOTOSENSITIVE RESIN LAMINATE, PHOTOSENSITIVE ELEMENT, AND PATTERN FORMING METHOD | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| CN-114114841-B | Photosensitive resin laminate and method for forming resist pattern | 旭化成株式会社 | 2026-05-12 | — | — | CN | disclosed |
| CN-122029490-A | Photosensitive resin laminate, method for forming resist pattern, and method for forming wiring board | 旭化成株式会社 | 2026-05-12 | — | — | CN | disclosed |
| US-12345850-B2 | Laminate and method for manufacturing laminate | FUJIFILM CORPORATION (JP) | 2025-07-01 | — | — | US | disclosed |
| CN-120077329-A | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern | 旭化成株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-120044756-A | Photosensitive resin composition | 旭化成株式会社 | 2025-05-27 | — | — | CN | disclosed |
| WO-2025095102-A1 | PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING CONDUCTOR PATTERN | 旭化成株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025074970-A1 | PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING BOARD | 旭化成株式会社 | 2025-04-10 | — | — | WO | disclosed |
| CN-1273867-C | Photosensitive resin composition and use thereof | ASAHI CHEMICAL IND (JP) | 2006-09-06 | — | — | CN | disclosed |
| CN-1596386-A | Photosensitive resin composition and applications thereof | ASAHI CHEMICAL IND (JP) | 2005-03-16 | — | — | CN | disclosed |
| US-20030085451-A1 | Wet etched insulator and electronic circuit component | DAI NIPPON PRINTING CO., LTD. (JP) | 2003-05-08 | — | — | US | disclosed |
| CN-1385756-A | Method for making electronic component using wet corrosion agent | DAINIPPON PRINTING CO LTD (JP) | 2002-12-18 | — | — | CN | disclosed |
| EP-0584780-B1 | Process for producing printed wiring board | HITACHI LTD (JP) | 1999-11-03 | — | — | EP | disclosed |
| US-5919603-A | Process for producing printed wiring board | HITACHI, LTD. (JP) | 1999-07-06 | — | — | US | disclosed |
| CN-1038806-C | Process for producing printed wiring board | HITACHI LTD (JP) | 1998-06-17 | — | — | CN | disclosed |
| US-5438751-A | Using developer with a chlorine-free organic solvent | HITACHI, LTD. (JP) | 1995-08-08 | — | — | US | disclosed |
| CN-1086372-A | Produce the method for printed substrate | HITACHI LTD (JP) | 1994-05-04 | — | — | CN | disclosed |
| EP-0584780-A2 | Process for producing printed wiring board | HITACHI, LTD. (JP) | 1994-03-02 | — | — | EP | disclosed |