SCHEMBL1133058

SCHEMBL1133058

C=CCNOC(=O)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9057655 0.98 KMT2A (0.35)
SCHEMBL28513567 0.98 KMT2A (0.35)
Propionic Acid SCHEMBL23646926 0.94 FFAR3 (0.39)
SCHEMBL4921535 0.83 ALDH1A1 (0.43)
SCHEMBL10676974 0.80 TSHR (0.35)
SCHEMBL27791161 0.80
SCHEMBL22776183 0.80
SCHEMBL28229519 0.79 MGAM (0.43)
SCHEMBL9811525 0.79 TSHR (0.54)
SCHEMBL9058758 0.78 KMT2A (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117769408-A Dual-phase cosmetic composition and use thereof 巴斯夫欧洲公司 2024-03-26 CN claimed
EP-3739002-B1 PHOTOVOLTAIC ENCAPSULATION MATERIAL WITH HIGH LIGHT TRANSMITTANCE HANGZHOU FIRST APPLIED MAT CO LTD (CN) 2024-01-17 EP claimed
CN-116981443-A Fully dilutable self-microemulsifying delivery systems (SMEDDS) for poorly water-soluble polar solutes 多伦多大学管理委员会 2023-10-31 CN claimed
US-20090137191-A1 COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS EKC TECHNOLOGY, INC. 2009-05-28 US claimed
WO-2009058272-A1 COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS EKC TECHNOLOGY, INC. (US) 2009-05-07 WO claimed
US-7022608-B2 Method and composition for the removal of residual materials during substrate planarization APPLIED MATERIALS INC. (US) 2006-04-04 US claimed
US-6653242-B1 Solution to metal re-deposition during substrate planarization APPLIED MATERIALS, INC. 2003-11-25 US claimed
US-20030216049-A1 Method and composition for the removal of residual materials during substrate planarization APPLIED MATERIALS, INC. 2003-11-20 US claimed
US-6555511-B2 Mixture of surfactants RENFROW LANCE L (US) 2003-04-29 US claimed
WO-2002044293-A2 METHOD AND COMPOSITION FOR THE REMOVAL OF RESIDUAL MATERIALS DURING SUBSTRATE PLANARIZATION APPLIED MATERIALS, INC. (US) 2002-06-06 WO claimed
US-20020068454-A1 Method and composition for the removal of residual materials during substrate planarization APPLIED MATERIALS, INC. 2002-06-06 US claimed
US-12036636-B2 Mega-sonic vibration assisted chemical mechanical planarization TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-07-16 US disclosed
US-12030159-B2 Chemical mechanical planarization tool TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-07-09 US disclosed
US-20240217054-A1 CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2024-07-04 US disclosed
US-12020946-B2 Chemical mechanical polishing apparatus Taiwan Semiconductor Manufacturing Co., Ld. (TW) 2024-06-25 US disclosed
US-5078782-A Suspended in an oily component BEROL NOBEL (SUISSE) S.A. (CH) 1992-01-07 US disclosed
EP-0243872-A1 Pesticidal concentrate compositions BEROL NOBEL (SUISSE) S.A. (CH) 1987-11-04 EP disclosed
US-4087550-A Hydroxylated amine thioethers for improving the greasy and unaesthetic appearance of the hair and skin L'OREAL (FR) 1978-05-02 US disclosed
US-3984569-A Cosmetic compositions for treating the hair containing S-substituted derivatives of glutathione L'OREAL (FR) 1976-10-05 US disclosed
US-3968218-A Cosmetic composition containing a hydroxylated amino thioether for application to the hair and skin L'OREAL (FR) 1976-07-06 US disclosed