Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP7 | Q9UHL4 | 2/20 | 0.36 |
| ▸ | PLA2G2C | Q5R387 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 6/20 | 0.32 |
| ▸ | TLR2 | O60603 | 6/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
| ▸ | RRM1 | P23921 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | CTSK | P43235 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1143088 | 0.91 | MAPT (0.32) | DPP7ACHECTSK | |
| SCHEMBL1142907 | 0.82 | — | — | |
| SCHEMBL1142589 | 0.72 | ACHE (0.40) | ACHE | |
| SCHEMBL1143028 | 0.71 | ACHE (0.42) | ACHE | |
| SCHEMBL1142509 | 0.70 | EPHX1 (0.43) | DPP7ACHE | |
| SCHEMBL1142597 | 0.69 | — | — | |
| SCHEMBL1142924 | 0.69 | EPHX1 (0.46) | ACHE | |
| SCHEMBL1142510 | 0.67 | EPHX1 (0.38) | ACHECYP3A4 | |
| SCHEMBL1142939 | 0.67 | TSHR (0.38) | ACHE | |
| SCHEMBL1142651 | 0.67 | MAPT (0.39) | ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8765868-B2 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-07-01 | — | — | US | disclosed |
| US-20110027544-A1 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-02-03 | — | — | US | disclosed |