SCHEMBL1142907

SCHEMBL1142907

CCCO[Si](C)(OCCC)OC(CC)CCNC(N)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1143088 0.83 MAPT (0.32)
SCHEMBL1142841 0.82 DPP7 (0.36)
SCHEMBL3155313 0.73 CHRNB2 (0.36)
SCHEMBL1142597 0.72
SCHEMBL1142958 0.70 ACHE (0.33)
SCHEMBL1142965 0.67 ACHE (0.39)
SCHEMBL1143006 0.66 ACHE (0.38)
SCHEMBL29287982 0.66 ACHE (0.31)
SCHEMBL28950889 0.66 MTNR1A (0.32)
SCHEMBL1142616 0.65 EPHX1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8765868-B2 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2014-07-01 US disclosed
US-20110027544-A1 Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2011-02-03 US disclosed