SCHEMBL1151623

SCHEMBL1151623

[CH2]C(O)COc1ccccc1-c1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADRB2 P07550 6/20 0.56
ADRB1 P08588 2/20 0.56
ALDH1A1 P00352 3/20 0.50
MAPK1 P28482 3/20 0.50
TP53 P04637 2/20 0.50
MAPT P10636 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
L3MBTL1 Q9Y468 2/20 0.50
RAB9A P51151 1/20 0.50
ADRA1A P35348 1/20 0.50
CYP1A2 P05177 1/20 0.50
CYP2D6 P10635 1/20 0.50
TSHR P16473 1/20 0.50
CYP2C19 P33261 1/20 0.50
HTR7 P34969 1/20 0.47
LMNA P02545 4/20 0.46
RXRA P19793 1/20 0.46
RXRB P28702 1/20 0.46
RXRG P48443 1/20 0.46
SMN1; SMN2 Q16637 3/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10408230 0.82 ADRB2 (0.64) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL12473595 0.82 ADRB2 (0.61) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL628327 0.79 ADRB2 (0.61) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL7047544 0.79 L3MBTL1 (0.55) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL772820 0.79 ADRB2 (0.61) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL15677631 0.79 ADRB2 (0.65) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL6230392 0.79 L3MBTL1 (0.58) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL15094850 0.78 ADRB2 (0.55) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL23391646 0.77 ADRB2 (0.58) ADRB2ADRB1ALDH1A1MAPK1TP53
SCHEMBL10203033 0.77 ADRB2 (0.62) ADRB2ADRB1ALDH1A1MAPK1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4383312-A1 FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE Resonac Corporation (JP) 2024-06-12 EP disclosed
CN-118053799-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-05-17 CN disclosed
WO-2024101212-A1 COMPOSITION FOR FORMING GLASS SURFACE TREATMENT FILM 日産化学株式会社 2024-05-16 WO disclosed
CN-117999642-A Conductive paste, cured product, sintering accelerator, and sintering acceleration method 住友电木株式会社 2024-05-07 CN disclosed
US-20240141150-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA, MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE RESONAC CORPORATION (JP) 2024-05-02 US disclosed
CN-117882174-A Temporary fixing film, temporary fixing laminate, and method for manufacturing semiconductor device 株式会社力森诺科 2024-04-12 CN disclosed
US-20240093059-A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL RESONAC CORPORATION (JP) 2024-03-21 US disclosed
WO-2024034464-A1 ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND MANUFACTURING METHOD THEREFOR 株式会社レゾナック 2024-02-15 WO disclosed
CN-117238828-A Laminate for temporary fixation and method for manufacturing semiconductor device 株式会社力森诺科 2023-12-15 CN disclosed
US-11840648-B2 Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material RESONAC CORPORATION (JP) 2023-12-12 US disclosed
US-20100221668-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE MAKINO TATSUYA 2010-09-02 US disclosed
US-20100209042-A1 METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE AND OPTICAL WAVEGUIDE MANUFACTURED BY THE METHOD HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-08-19 US disclosed
EP-2189826-A1 METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE AND OPTICAL WAVEGUIDE MANUFACTURED BY THE METHOD Hitachi Chemical Company, Ltd. (JP) 2010-05-26 EP disclosed
EP-2182410-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PHOTOSENSITIVE RESIN PRODUCT, PHOTOSENSITIVE RESIN FILM, CURED PHOTOSENSITIVE RESIN FILM PRODUCT, AND OPTICAL WAVEGUIDE PRODUCED BY USING THOSE PRODUCTS Hitachi Chemical Company, Ltd. (JP) 2010-05-05 EP disclosed
US-20100040339-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THEM HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-02-18 US disclosed
EP-2112181-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THEM Hitachi Chemical Company, Ltd. (JP) 2009-10-28 EP disclosed
EP-2045629-A1 RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE Hitachi Chemical Company, Ltd. (JP) 2009-04-08 EP disclosed
US-20090062421-A1 Phenoxy Resin for Optical Material, Resin Composition for Optical Material, Resin Film For Optical Material and Optical Waveguide Using Those HITACHI CHEIMICAL COMPANY LTD. (JP) 2009-03-05 US disclosed
EP-1995266-A1 PHENOXY RESIN FOR OPTICAL MATERIAL, RESIN COMPOSITION FOR OPTICAL MATERIAL, RESIN FILM FOR OPTICAL MATERIAL, AND OPTICAL WAVEGUIDE USING THOSE Hitachi Chemical Co., Ltd. (JP) 2008-11-26 EP disclosed
EP-1983360-A1 FLEXIBLE OPTICAL WAVEGUIDE AND OPTICAL MODULE Hitachi Chemical Co., Ltd. (JP) 2008-10-22 EP disclosed