Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.39 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | APEX1 | P27695 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 3/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | PPM1B | O75688 | 1/20 | 0.31 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.31 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7202203 | 0.95 | POLB (0.42) | THRBPOLBAPEX1HTTTDP1 | |
| SCHEMBL7202089 | 0.95 | POLB (0.40) | THRBPOLBAPEX1HTTTDP1 | |
| SCHEMBL7703928 | 0.92 | THRB (0.41) | THRBPOLBAPEX1HTTTDP1 | |
| SCHEMBL2781080 | 0.90 | THRB (0.39) | THRBPOLBAPEX1HTTTDP1 | |
| SCHEMBL14990612 | 0.85 | — | — | |
| SCHEMBL10963112 | 0.84 | TSHR (0.33) | TSHR | |
| SCHEMBL2200972 | 0.83 | TSHR (0.37) | TSHRMAPT | |
| SCHEMBL11616214 | 0.82 | MAPT (0.35) | MAPT | |
| SCHEMBL11679846 | 0.82 | MAPT (0.35) | TDP1ALDH1A1MAPT | |
| SCHEMBL6323292 | 0.82 | PPM1B (0.47) | TDP1TSHRALDH1A1MAPTPPM1B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240150549-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA AND MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | RESONAC CORPORATION (JP) | 2024-05-09 | — | — | US | disclosed |
| EP-3786247-B1 | LATEX FOR ADHESIVE COMPOSITION AND ADHESIVE COMPOSITION | RESONAC CORP (JP) | 2023-12-27 | — | — | EP | disclosed |
| EP-4282397-A1 | COSMETIC PREPARATION | Shiseido Company, Ltd. (JP) | 2023-11-29 | — | — | EP | disclosed |
| WO-2023210746-A1 | POLYMER, CURABLE RESIN COMPOSITION, STRETCHABLE INSULATING CURED FILM OBTAINED BY CURING SAID COMPOSITION, INSULATING CURED FILM FOR TOUCH PANEL, TOUCH PANEL, INSULATING CURED FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD | 大阪有機化学工業株式会社 | 2023-11-02 | — | — | WO | disclosed |
| US-20230197630-A1 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION | RESONAC CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| WO-2022177009-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA AND MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | 昭和電工マテリアルズ株式会社 | 2022-08-25 | — | — | WO | disclosed |
| EP-3260477-B1 | COMPOSITION FOR POLYMERIZATION, METHOD FOR PRODUCING SAME, COATING COMPOSITION CONTAINING SAME, METHOD FOR PRODUCING COATING COMPOSITION CONTAINING SAID COMPOSITIONS, AND METHOD FOR PRODUCING COATING | FUJIFILM CORP (JP) | 2022-08-24 | — | — | EP | disclosed |
| CN-114755886-A | Photosensitive resin composition, dry film, cured product and printed wiring board | 互应化学工业株式会社 | 2022-07-15 | — | — | CN | disclosed |
| US-11330721-B2 | Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film | SHOWA DENKO MATERIALS CO., LTD (JP) | 2022-05-10 | — | — | US | disclosed |
| CN-108475015-B | Photosensitive resin composition, dry film and printed wiring board | 互应化学工业株式会社 | 2022-03-18 | — | — | CN | disclosed |
| EP-1296186-A1 | Radiation sensitive resin composition, rib, rib forming method and display element | JSR Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-20020146629-A1 | Ultraviolet-curable resin composition | TAIYO INK MANUFACTURING CO., LTD. (JP) | 2002-10-10 | — | — | US | disclosed |
| EP-1219680-A1 | ULTRAVIOLET-CURABLE RESIN COMPOSITION | Taiyo Ink Manufacturing Co. Ltd (JP) | 2002-07-03 | — | — | EP | disclosed |
| US-6344299-B1 | 3,3',4,4'-BENZOPHENONETETRACARBOXYLIC DIANHYDRIDE DERIVATIVES | CHISSO CORPORATION (JP) | 2002-02-05 | — | — | US | disclosed |
| EP-0880075-B1 | Radiation sensitive resin composition | JSR CORP (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-6143803-A | PROTECTION WITH CURABLE FILM AND ETCHING | TOAGOSEI CO., LTD. (JP) | 2000-11-07 | — | — | US | disclosed |
| US-5958648-A | Radiation sensitive resin composition | JSR CORPORATION (JP) | 1999-09-28 | — | — | US | disclosed |
| EP-0880075-A1 | Radiation sensitive resin composition | JSR Corporation (JP) | 1998-11-25 | — | — | EP | disclosed |
| US-5336574-A | Secondary etch resist material containing a compound with a (meth)acryloyl and a carboxy group and another with two or more (meth)acryloyl groups, along with a leveling agent and a chain transfer agent and/or a photoinitiator | TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) | 1994-08-09 | — | — | US | disclosed |
| US-4551215-A | EPOXY COMPOUND, PHOTOPOLYMERIZABLE COMPOUND HAVING CARBOXYL, AND PHOTOSENSITIZER | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 1985-11-05 | — | — | US | disclosed |