SCHEMBL7202089

SCHEMBL7202089

C=C(C)C(=O)OCCCOC(=O)C1C=CCCC1C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.40
APEX1 P27695 1/20 0.40
HTT P42858 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
TSHR P16473 2/20 0.39
THRB P10828 1/20 0.34
ALDH1A1 P00352 1/20 0.33
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7202203 0.97 POLB (0.42) POLBAPEX1HTTTDP1TSHR
SCHEMBL1151750 0.95 THRB (0.39) POLBAPEX1HTTTDP1TSHR
SCHEMBL7703928 0.87 THRB (0.41) POLBAPEX1HTTTDP1TSHR
SCHEMBL2781080 0.85 THRB (0.39) POLBAPEX1HTTTDP1TSHR
SCHEMBL6322622 0.83 MAPK1 (0.40) POLBTDP1TSHRALDH1A1
SCHEMBL14990612 0.82
SCHEMBL10963112 0.82 TSHR (0.33) TSHR
SCHEMBL13571377 0.81 USP2 (0.31) TDP1ALDH1A1MAPT
SCHEMBL7199881 0.81 TSHR (0.41) TDP1TSHRTHRBALDH1A1
Butane SCHEMBL11241850 0.81 PPARG (0.40) POLBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8722768-B2 Liquid resin composition and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2014-05-13 US disclosed
EP-2624287-A1 LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2013-08-07 EP disclosed
US-20130143983-A1 LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2013-06-06 US disclosed
US-6602643-B2 Useful as a protective material for etching, as back-coating material in the production of a shadow mask TAIYO INK MANUFACTURING CO., LTD. (JP) 2003-08-05 US disclosed
US-20020146629-A1 Ultraviolet-curable resin composition TAIYO INK MANUFACTURING CO., LTD. (JP) 2002-10-10 US disclosed
EP-1219680-A1 ULTRAVIOLET-CURABLE RESIN COMPOSITION Taiyo Ink Manufacturing Co. Ltd (JP) 2002-07-03 EP disclosed
US-6143803-A PROTECTION WITH CURABLE FILM AND ETCHING TOAGOSEI CO., LTD. (JP) 2000-11-07 US disclosed
US-5336574-A Secondary etch resist material containing a compound with a (meth)acryloyl and a carboxy group and another with two or more (meth)acryloyl groups, along with a leveling agent and a chain transfer agent and/or a photoinitiator TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1994-08-09 US disclosed
US-4112190-A Metallized plastic molding MITSUBISHI RAYON CO., LTD. (JP) 1978-09-05 US disclosed