SCHEMBL116

SCHEMBL116

Sc1ncc[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25231508 1.00 ALDH1A1 (0.46)
SCHEMBL10343352 0.97
SCHEMBL2269935 0.97
SCHEMBL2269360 0.97
SCHEMBL2269356 0.97
SCHEMBL5506833 0.97
Hydrogen Sulfide SCHEMBL15821640 0.97
Ammonia Solution, Strong SCHEMBL9403872 0.97
SCHEMBL2271924 0.97
SCHEMBL29234935 0.97

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 9194 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119798128-B Preparation method of dicumyl peroxide 万华化学集团股份有限公司 2026-05-19 CN claimed
CN-122032495-A Radio frequency plasma oxidation modified porous carbon material and preparation method thereof 上海玄电新材料有限公司 2026-05-15 CN claimed
CN-121282568-B Diaphragm and battery 珠海冠宇电池股份有限公司 2026-05-12 CN claimed
CN-121238173-B Diaphragm and battery 珠海冠宇电池股份有限公司 2026-05-12 CN claimed
US-20260078517-A1 COMPOSITION AND METHOD FOR NANOTWINNED COPPER FORMATION MACDERMID ENTHONE INC (US) 2026-03-19 US claimed
CN-121574183-A HER2 protein targeting covalent binding polypeptide molecule and application thereof 中国人民解放军总医院 2026-02-27 CN claimed
US-20250313958-A1 METHOD FOR NANO ETCHING OF COPPER AND COPPER ALLOY SURFACES Atotech Deutschland GmbH & Co. KG (DE) 2025-10-09 US claimed
US-20250263875-A1 DEDUSTING OIL COMPOSITIONS WITH ENHANCED HEAT RESISTANCE JOHNS MANVILLE 2025-08-21 US claimed
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate HANGZHOU FIRST ELECTRONIC MATERIAL CO., LTD (CN) 2025-07-24 US claimed
US-12351702-B2 Compositions and methods for producing electrically conductive coordination polymers and uses thereof CLARKSON UNIVERSITY (US) 2025-07-08 US claimed
US-4163669-A CONTAINING HEAVY METAL SALT OF ORGANIC COMPOUND MITSUBISHI PAPER MILLS, LTD. (JP) 1979-08-07 US claimed
US-4147864-A Process for the manufacture of 7β-amino-3-cephem-3-ol-4 carboxylic acid compounds CIBA-GEIGY CORPORATION (US) 1979-04-03 US claimed
US-4145540-A ANTIBIOTICS TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 1979-03-20 US claimed
US-4110533-A PROCESS FOR THE MANUFACTURE OF ENOL DERIVATIVES CIBA-GEIGY CORPORATION (US) 1978-08-29 US claimed
US-4080493-A POLYBUTADIENE, POLYISOPRENE, GELATION INHIBITOR SUMITOMO CHEMICAL COMPANY, LIMITED (JA) 1978-03-21 US claimed
US-4060687-A Cephalosporins having a 3-α substituted alkyl grouping MERCK & CO., INC. (US) 1977-11-29 US claimed
US-4051129-A REACTION OF BENZYLIDENIMINO GROUP WITH HYDRAZINE, AMIDATION SANKYO COMPANY LIMITED (JA) 1977-09-27 US claimed
US-4017488-A Process for preparing 7β-acylamino-7α-alkoxycephalosporins SANKYO COMPANY LIMITED (JA) 1977-04-12 US claimed
US-3997346-A Method for stabilizing the image of a thermally developable photosensitive material FUJI PHOTO FILM CO., LTD. (JA) 1976-12-14 US claimed
US-3954732-A BACTERICIDAL PENICILLINS FUJISAWA PHARMACEUTICAL CO., LTD. (JA) 1976-05-04 US claimed