SCHEMBL116749

SCHEMBL116749

CC(=O)OC(=O)C1CCCO1

nearest known ligand 0.44

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HPGD P15428 6/20 0.44
TSHR P16473 1/20 0.44
NPSR1 Q6W5P4 1/20 0.44
NOS2 P35228 1/20 0.41
KMT2A Q03164 3/20 0.41
MEN1 O00255 2/20 0.41
ALDH1A1 P00352 6/20 0.39
NPC1 O15118 1/20 0.39
RAB9A P51151 1/20 0.39
POLB P06746 2/20 0.38
RECQL P46063 1/20 0.38
SMN1; SMN2 Q16637 3/20 0.37
TP53 P04637 1/20 0.37
HSD17B10 Q99714 1/20 0.37
KDM4E B2RXH2 1/20 0.37
GAA P10253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30135380 0.87 NOS2 (0.46) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL9328453 0.87 NOS2 (0.46) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL30135339 0.87 NOS2 (0.46) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL379290 0.82 HPGD (0.40) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL5046503 0.81 HPGD (0.44) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL20599743 0.79 RECQL (0.45) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL6444441 0.79
SCHEMBL1625646 0.79
SCHEMBL31343355 0.79 HPGD (0.43) HPGDTSHRNPSR1NOS2KMT2A
SCHEMBL7016675 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1553134-B1 Polyimide compositions having resistance to water sorption, and methods relating thereto DU PONT (US) 2009-12-23 EP claimed
US-7348373-B2 Polyimide compositions having resistance to water sorption, and methods relating thereto E.I. DU PONT DE NEMOURS AND COMPANY (US) 2008-03-25 US claimed
US-20050154181-A1 Polyimide compositions having resistance to water sorption, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2005-07-14 US claimed
EP-1553134-A2 Polyimide compositions having resistance to water sorption, and methods relating thereto E.I. DU PONT DE NEMOURS AND COMPANY (US) 2005-07-13 EP claimed
EP-2877135-B1 SILICONE/ACRYLIC HYBRID ADHESIVES AVERY DENNISON CORP (US) 2018-06-20 EP disclosed
EP-2424948-B1 RELEASABLE ADHESIVE HAVING A MULTILAYER SUBSTRATE AVERY DENNISON CORP (US) 2017-03-22 EP disclosed
EP-2773304-B1 DISRUPTABLE ADHESIVE LAYER FOR FLUID ACTIVATED DEBONDING AVERY DENNISON CORP (US) 2016-03-30 EP disclosed
US-20150182383-A1 Silicone/Acrylic Hybrid Adhesives AVERY DENNISON CORPORATION 2015-07-02 US disclosed
EP-2877135-A1 SILICONE/ACRYLIC HYBRID ADHESIVES Avery Dennison Corporation (US) 2015-06-03 EP disclosed
US-8957277-B2 Disruptable adhesive layer for fluid activated debonding AVERY DENNISON CORPORATION (US) 2015-02-17 US disclosed
US-8946499-B2 Systems, methods and materials for delivery and debonding on demand AVERY DENNISON CORPORATION (US) 2015-02-03 US disclosed
EP-2773304-A1 DISRUPTABLE ADHESIVE LAYER FOR FLUID ACTIVATED DEBONDING Avery Dennison Corporation (US) 2014-09-10 EP disclosed
WO-2010129299-A2 SYSTEMS, METHODS AND MATERIALS FOR DELIVERY AND DEBONDING ON DEMAND AVERY DENNISON CORPORATION (US) 2010-11-11 WO disclosed
EP-1553134-B1 Polyimide compositions having resistance to water sorption, and methods relating thereto DU PONT (US) 2009-12-23 EP disclosed
EP-2068604-A2 Screen-printable encapsulants based on soluble polybenzoxazoles E. I. Du Pont de Nemours and Company (US) 2009-06-10 EP disclosed
US-7348373-B2 Polyimide compositions having resistance to water sorption, and methods relating thereto E.I. DU PONT DE NEMOURS AND COMPANY (US) 2008-03-25 US disclosed
US-7338715-B2 Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto E.I. DU PONT DE NEMOURS AND COMPANY (US) 2008-03-04 US disclosed
US-20070154726-A1 Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2007-07-05 US disclosed
US-20050154181-A1 Polyimide compositions having resistance to water sorption, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2005-07-14 US disclosed
EP-1553134-A2 Polyimide compositions having resistance to water sorption, and methods relating thereto E.I. DU PONT DE NEMOURS AND COMPANY (US) 2005-07-13 EP disclosed