SCHEMBL1171909

SCHEMBL1171909

CCCCCCCCC(C)C(C)(C)P

nearest known ligand 0.42

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.42
SPHK1 Q9NYA1 1/20 0.40
LMNA P02545 1/20 0.39
DNM1 Q05193 2/20 0.39
TSHR P16473 1/20 0.38
THRB P10828 1/20 0.38
ADH1B P00325 1/20 0.38
ADH1C P00326 1/20 0.38
ADH1A P07327 1/20 0.38
ADH4 P08319 1/20 0.38
ADH7 P40394 1/20 0.38
CA2 P00918 1/20 0.38
ACE2 Q9BYF1 1/20 0.36
GPR84 Q9NQS5 3/20 0.35
FDPS P14324 3/20 0.35
FFAR1 O14842 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL349368 1.00 OPRM1 (0.42) OPRM1SPHK1LMNADNM1TSHR
SCHEMBL2836084 1.00 OPRM1 (0.42) OPRM1SPHK1LMNADNM1TSHR
SCHEMBL8141589 1.00 OPRM1 (0.42) OPRM1SPHK1LMNADNM1TSHR
SCHEMBL2871557 1.00 OPRM1 (0.42) OPRM1SPHK1LMNADNM1TSHR
SCHEMBL413280 1.00 OPRM1 (0.42) OPRM1SPHK1LMNADNM1TSHR
SCHEMBL415427 1.00 OPRM1 (0.42) OPRM1SPHK1LMNADNM1TSHR
Bromide SCHEMBL5089312 0.98 OPRM1 (0.41) OPRM1SPHK1LMNADNM1TSHR
Iodide SCHEMBL5086753 0.98 OPRM1 (0.41) OPRM1SPHK1LMNADNM1TSHR
Hydrochloric Acid SCHEMBL5085417 0.98 OPRM1 (0.41) OPRM1SPHK1LMNADNM1TSHR
Iodide SCHEMBL5138687 0.98 OPRM1 (0.41) OPRM1SPHK1LMNADNM1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 158 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025079674-A1 THERMOPLASTIC RESIN COMPOSITION 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079719-A1 COPOLYESTER FILM AND HEAT-SHRINKABLE POLYESTER FILM 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079679-A1 POLYESTER FILM, METHOD FOR PRODUCING SAME, AND RESIN COMPOSITION 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079727-A1 LAMINATE HAVING POLYESTER FILM AND FUNCTIONAL LAYER 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079717-A1 POLYESTER FILM HAVING RESIN THIN FILM LAYER 東洋紡株式会社 2025-04-17 WO disclosed
WO-2025079681-A1 WHITE POLYESTER FILM 東洋紡株式会社 2025-04-17 WO disclosed
CN-114716944-B Surface protective film 日东电工株式会社 2025-02-25 CN disclosed
CN-110875348-B Display apparatus 三星显示有限公司 2025-02-07 CN disclosed
CN-119159883-A Laminate, image display member, method for manufacturing image display member, mobile electronic device, and method for manufacturing mobile electronic device 日东电工株式会社 2024-12-20 CN disclosed
CN-111849369-B Surface protective film and optical member 日东电工株式会社 2024-04-26 CN disclosed
EP-1582573-A2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film Nitto Denko Corporation (JP) 2005-10-05 EP disclosed
CN-1667071-A Adhesive composition, adhesive sheets and surface protective film NITTO DENKO CORP (JP) 2005-09-14 CN disclosed
US-20050197450-A1 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film NITTO DENKO CORPORATION (JP) 2005-09-08 US disclosed
US-20040197561-A1 Process for producing surface-treated inorganic particle and surface-treated inogranic particle KANEKA CORPORATION (JP) 2004-10-07 US disclosed
EP-1420049-A1 PROCESS FOR PRODUCING SURFACE−TREATED INORGANIC PARTICLE AND SURFACE−TREATED INORGANIC PARTICLE KANEKA CORPORATION (JP) 2004-05-19 EP disclosed
US-20040044144-A1 Polyester resin composition containing inorganic filler, polyetherimide, and polymer containing polyethylene naphthalate in constituent unit thereof FUJI PHOTO FILM CO., LTD. 2004-03-04 US disclosed
EP-1394212-A1 Polyester resin composition containing inorganic filler, polyetherimide, and polymer containing polyethylene naphthalate in constituent unit thereof Fuji Photo Film Co., Ltd. (JP) 2004-03-03 EP disclosed
EP-0246825-B1 QUATERNARY SALT SOLUTION ELECTROLYTE FOR ELECTROLYTIC CAPACITORS MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-02-27 EP disclosed
US-4774011-A Electrolyte for aluminum electrolytic capacitor MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1988-09-27 US disclosed
EP-0246825-A2 Quaternary salt solution electrolyte for electrolytic capacitors MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1987-11-25 EP disclosed