⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butanal SCHEMBL7474945 | 1.00 | — | — | |
| Butanal SCHEMBL27726106 | 0.93 | — | — | |
| Butanal SCHEMBL597713 | 0.93 | ALDH1A1 (1.00) | — | |
| Butanal SCHEMBL9303364 | 0.93 | ALDH1A1 (1.00) | — | |
| Butanal SCHEMBL807 | 0.93 | — | — | |
| Butanal SCHEMBL7323870 | 0.93 | — | — | |
| Butanal SCHEMBL23854344 | 0.89 | — | — | |
| Butanal SCHEMBL2950600 | 0.89 | — | — | |
| Butanal SCHEMBL284804 | 0.89 | — | — | |
| Butanal SCHEMBL21142995 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5959256-A | Multilayer printed wiring board | MITSUI MINING & SMELTING CO., LTD. (JP) | 1999-09-28 | — | — | US | claimed |
| EP-0432208-B1 | PROCESS FOR PRODUCING FATTY ALCOHOL DERIVATIVES | HENKEL KGAA (DE) | 1993-12-15 | — | — | EP | claimed |
| US-5202406-A | Low viscosity, low volatility | MILES INC. (US) | 1993-04-13 | — | — | US | claimed |
| US-20230220219-A1 | COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS | PPG INDUSTRIES OHIO, INC. (US) | 2023-07-13 | — | — | US | disclosed |
| EP-4136140-A1 | COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS | PPG Industries Ohio Inc. (US) | 2023-02-22 | — | — | EP | disclosed |
| WO-2021211182-A1 | COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS | PPG INDUSTRIES OHIO, INC. (US) | 2021-10-21 | — | — | WO | disclosed |
| WO-2021211722-A1 | COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLERS | PPG INDUSTRIES OHIO, INC. (US) | 2021-10-21 | — | — | WO | disclosed |
| EP-1256336-B1 | Two-phase gel composition | PENRECO (US) | 2016-10-19 | — | — | EP | disclosed |
| US-9339446-B2 | Gel composition | CALUMET PENRECO, LLC (US) | 2016-05-17 | — | — | US | disclosed |
| US-20110045983-A1 | Gel composition | WILMINGTON TRUST, NATIONAL ASSOCIATION | 2011-02-24 | — | — | US | disclosed |
| US-20090232753-A1 | Gel compositions | HEALY LIN LU | 2009-09-17 | — | — | US | disclosed |
| US-5959256-A | Multilayer printed wiring board | MITSUI MINING & SMELTING CO., LTD. (JP) | 1999-09-28 | — | — | US | disclosed |
| US-5807970-A | Blood compatible, shear sensitive formulations | BECTON, DICKINSON AND COMPANY (US) | 1998-09-15 | — | — | US | disclosed |
| US-5800722-A | COPPER CIRCUIT; DIELECTRIC | MITSUI MINING & SMELTING CO., LTD. (JP) | 1998-09-01 | — | — | US | disclosed |
| US-5743656-A | Hydrodynamic bearing apparatus and method for manufacturing same | SANKYO SEIKI MFG. CO. LTD. (JP) | 1998-04-28 | — | — | US | disclosed |
| US-5718039-A | ADHERING COPPER FOILS, MASKING, ETCHING | MITSUI MINING & SMELTING CO., LTD. (JP) | 1998-02-17 | — | — | US | disclosed |
| US-5663285-A | POLYESTER VISCOELASTIC DISPERSION FOR SEPARATING BLOOD SERUM OR PLASMA FROM CELLULAR PORTION | BECTON DICKINSON AND COMPANY (US) | 1997-09-02 | — | — | US | disclosed |
| EP-0741505-A2 | Multilayer printed wiring board and process for manufacturing the same | MITSUI MINING & SMELTING CO., LTD. (JP) | 1996-11-06 | — | — | EP | disclosed |
| EP-0705882-A2 | Blood compatible, shear sensitive formulations | Becton, Dickinson and Company (US) | 1996-04-10 | — | — | EP | disclosed |
| WO-1988000225-A1 | SYSTEMS FOR CROSS-LINKABLE HEAT-MELTABLE ADHESIVES, PREPARATION THEREOF AND CORRESPONDING GLUING METHOD | SOCIETE CHIMIQUE DES CHARBONNAGES (FR) | 1988-01-14 | — | — | WO | disclosed |