SCHEMBL117901

SCHEMBL117901

C=CC(C=C)=Cc1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.50
TSHR P16473 2/20 0.50
AKR1C3 P42330 1/20 0.43
AKR1C1 Q04828 1/20 0.41
ESR1 P03372 1/20 0.41
AKT1 P31749 1/20 0.41
FBP1 P09467 3/20 0.39
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
MAOB P27338 1/20 0.38
PRMT1 Q99873 1/20 0.38
CYP2A6 P11509 1/20 0.38
TGM2 P21980 1/20 0.37
MCL1 Q07820 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzene SCHEMBL7850990 1.00 ALDH1A1 (0.50) ALDH1A1TSHRAKR1C3AKR1C1ESR1
Iodide SCHEMBL6554697 0.97 ALDH1A1 (0.48) ALDH1A1TSHRAKR1C3AKR1C1ESR1
Styrene SCHEMBL9849012 0.93 ALDH1A1 (0.64) ALDH1A1TSHRAKR1C3AKR1C1ESR1
SCHEMBL1456820 0.87 ALDH1A1 (0.44) ALDH1A1TSHRAKR1C3AKR1C1ESR1
SCHEMBL10643212 0.86 ALDH1A1 (0.52) ALDH1A1TSHRAKR1C3AKR1C1AKT1
SCHEMBL28555738 0.86 TP53 (0.53) ALDH1A1TSHRCYP3A4
SCHEMBL372391 0.83 ALDH1A1 (0.39) ALDH1A1TSHRAKR1C3AKR1C1ESR1
SCHEMBL3800084 0.82 TSHR (0.57) ALDH1A1TSHRAKR1C3
SCHEMBL9333290 0.81 HDAC3 (0.50) ALDH1A1TSHRAKR1C3AKR1C1AKT1
SCHEMBL28778287 0.80 ALDH1A1 (0.53) ALDH1A1TSHRAKR1C3AKR1C1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 758 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119912893-A Curing adhesive, S-type epoxy compound with binaphthyl, preparation method and application 宁波天璇新材料科技有限公司 2025-05-02 CN claimed
WO-2023242201-A1 HOT MELT ADHESIVE COMPOSITION BOSTIK SA (FR) 2023-12-21 WO claimed
WO-2023242208-A1 HOT MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION BOSTIK SA (FR) 2023-12-21 WO claimed
EP-4293089-A1 HOT MELT ADHESIVE COMPOSITION Bostik SA (FR) 2023-12-20 EP claimed
EP-4293090-A1 HOT MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION Bostik SA (FR) 2023-12-20 EP claimed
CN-116239857-A Anti-freezing conductive gel and preparation and application thereof 上海应用技术大学 2023-06-09 CN claimed
CN-114736392-A High-strength self-healing hydrogel and preparation method thereof 武汉轻工大学 2022-07-12 CN claimed
EP-3309217-B1 POLYCARBONATE COMPOSITION AND PREPARATION METHOD THEREFOR KINGFA SCIENCE & TECHNOLOGY CO (CN) 2022-04-06 EP claimed
CN-112876611-B Method for preparing conductive polysaccharide composite hydrogel by adopting front-end polymerization of polysaccharide eutectic solvent mixture solution 湖北理工学院 2022-03-15 CN claimed
CN-112876611-A Method for preparing conductive polysaccharide composite hydrogel by adopting front-end polymerization of polysaccharide eutectic solvent mixture solution 湖北理工学院 2021-06-01 CN claimed
WO-1996026184-A1 SULFUR-CONTAINING COMPOUNDS FOR OPTICAL GRADE POLYMERIC CASTING COMPOSITIONS UCB, S.A. (BE) 1996-08-29 WO claimed
EP-0443792-B1 Rubber compounding resin INDSPEC CHEMICAL CORP (US) 1995-10-18 EP claimed
US-5391667-A Blend with ethynically unsaturated monomer having atleast one amine or amine-displaceable functionality and crosslinking agent; supports ISIS PHARMACEUTICALS (US) 1995-02-21 US claimed
US-5024785-A Liquid crystal/rigid rodlike polymer modified epoxy/vinyl ester resins THE DOW CHEMICAL COMPANY (US) 1991-06-18 US claimed
EP-0176977-B1 METHOD FOR PREPARING SEMICONDUCTOR STRUCTURES AND DEVICES WHICH UTILIZE TRENCHES FILLED WITH POLYMERIC DIELETRIC MATERIALS International Business Machines Corporation (US) 1991-05-15 EP claimed
EP-0386404-A2 Liquid crystal/rigid rodlike polymer modified epoxy/vinyl ester resins THE DOW CHEMICAL COMPANY (US) 1990-09-12 EP claimed
US-4599136-A Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1986-07-08 US claimed
EP-0075815-B1 WATER-INSOLUBLE PROTEIN MATERIAL, PROCESS FOR PREPARING IT AND ITS USE BASF Aktiengesellschaft (DE) 1986-03-19 EP claimed
US-4478976-A Water-insoluble protein material, its preparation and its use BASF AKTIENGESELLSCHAFT (DE) 1984-10-23 US claimed
EP-0075815-A2 Water-insoluble protein material, process for preparing it and its use BASF Aktiengesellschaft (DE) 1983-04-06 EP claimed