SCHEMBL11816617

SCHEMBL11816617

CC=C=CC1CCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10369058 0.72
SCHEMBL16640666 0.70
SCHEMBL1437684 0.69
SCHEMBL1437683 0.69
SCHEMBL16640669 0.69
SCHEMBL3032794 0.67 ADH1C (0.32)
SCHEMBL4944 0.67 ADH1C (0.32)
SCHEMBL8183865 0.67 ADH1C (0.32)
SCHEMBL4940 0.67
SCHEMBL8186468 0.67 ADH1C (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112513219-B Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2023-10-20 CN disclosed
CN-112513219-A Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2021-03-16 CN disclosed
WO-2020066416-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed
WO-2020054226-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-03-19 WO disclosed
US-3957892-A A CONJUGATED DIENE AND A PHENOL ETHYL CORPORATION (US) 1976-05-18 US disclosed