SCHEMBL1185276

SCHEMBL1185276

[SiH3]OCCCCNc1ccccc1

nearest known ligand 0.61

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.61
ALDH1A1 P00352 1/20 0.61
L3MBTL1 Q9Y468 1/20 0.44
HDAC3 O15379 1/20 0.39
HDAC1 Q13547 1/20 0.39
HDAC2 Q92769 1/20 0.39
NCOR2 Q9Y618 1/20 0.39
KCNH3 Q9ULD8 3/20 0.38
PPARG P37231 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP3A4 P08684 1/20 0.37
CYP2C19 P33261 1/20 0.37
KCNA3 P22001 1/20 0.37
ACHE P22303 1/20 0.36
PRSS1 P07477 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4030091 0.94 MAPT (0.64) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL4970157 0.82 ALDH1A1 (0.89) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL4104788 0.80 ALDH1A1 (0.84) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL11759173 0.80 ALDH1A1 (0.84) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL14968385 0.80 ALDH1A1 (0.84) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL4643729 0.80 ALDH1A1 (0.84) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL11894824 0.80 KCNA3 (0.64) MAPTALDH1A1L3MBTL1HDAC3HDAC1
SCHEMBL11637357 0.80 MAPT (0.61) MAPTALDH1A1L3MBTL1KCNH3PPARG
SCHEMBL11637424 0.78 MAPT (0.59) MAPTALDH1A1L3MBTL1KCNH3PPARG
SCHEMBL11634715 0.78 MAPT (0.59) MAPTALDH1A1L3MBTL1KCNH3PPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20110031443-A1 Multicomponent carbon nanotube-polymer complex, composition for forming the same, and preparation method thereof SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-02-10 US claimed
EP-0171986-B1 SILANE-CROSSLINKABLE HALOGENATED POLYMER COMPOSITION AND PROCESS OF CROSSLINKING THE SAME FUJIKURA LTD. (JP) 1989-10-18 EP claimed
JP-10237314-A None JP disclosed
EP-4644505-A1 ADHESIVE COMPOSITION, CURED BODY, AND ADHESIVE FOR ELECTRONIC DEVICES Sekisui Chemical Co., Ltd. (JP) 2025-11-05 EP disclosed
CN-113372814-B Cage-shaped polysilsesquioxane-based super-hydrophilic functional coating and preparation method thereof 广州一新科技有限公司 2022-02-25 CN disclosed
CN-113372814-A Cage-shaped polysilsesquioxane-based super-hydrophilic functional coating and preparation method thereof 广州一新科技有限公司 2021-09-10 CN disclosed
EP-3133076-B1 ALKOXYSILYL-VINYLENE GROUP-CONTAINING SILICON COMPOUND SHINETSU CHEMICAL CO (JP) 2019-10-02 EP disclosed
US-10415127-B2 Turbomachine components manufactured with carbon nanotube composites DRESSER-RAND COMPANY (US) 2019-09-17 US disclosed
EP-3041968-B1 TURBOMACHINE COMPONENTS MANUFACTURED WITH CARBON NANOTUBE COMPOSITES DRESSER RAND CO (US) 2018-10-24 EP disclosed
US-10070521-B2 Surface-treated copper foil JX NIPPON MINING & METALS CORPORATION (JP) 2018-09-04 US disclosed
US-9920080-B2 Alkoxysilyl-vinylene group-containing silicon compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-20 US disclosed
US-6037418-A ELASTOMER COMPRISING RUBBER WITH POLYOLEFIN IN FORM OF PARTICLES OF SPECIFIED SIZE DISPERSED THEREIN, LINKED TOGETHER VIA SILANE COUPLING AGENT BRIDGESTONE CORPORATION (JP) 2000-03-14 US disclosed
US-5985455-A P,P*-DIHYDROXYBIPHENYL MONOMER; PHENOLIC HARDENER; ACCURACY; WATERPROOFING, HEAT RESISTANCE TORAY INDUSTRIES, INC. (JP) 1999-11-16 US disclosed
EP-0867471-A1 Resin-reinforced elastomer, process for producing same and pneumatic tire using same Bridgestone Corporation (JP) 1998-09-30 EP disclosed
JP-H10237314-A PRODUCTION OF WOOD-BASED MOLDED PRODUCT CCI CORP 1998-09-08 JP disclosed
US-5798400-A MIXING TOGETHER POLYEPOXIDES, A HARDENER CONTAINING ATLEAST TWO PHENOLIC HYDROXY AND/OR NAPHTHOLIC HYDROXY GROUP, SYNTHETIC AND NATURAL FUSED SILICA FILLER TO FORM A RESIN, USED FOR SEMICONDUCTOR SEALILNG TORAY INDUSTRIES, INC. (JP) 1998-08-25 US disclosed
EP-0749996-A1 EPOXY RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1996-12-27 EP disclosed
EP-0423334-B1 RESIN COMPOSITION AND PROCESS FOR FORMING TRANSPARENT THIN FILM NIPPON KAYAKU KK (JP) 1996-09-18 EP disclosed
US-5180794-A Resin compositions and process for forming transparent thin films NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1993-01-19 US disclosed
EP-0423334-A1 RESIN COMPOSITION AND PROCESS FOR FORMING TRANSPARENT THIN FILM NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1991-04-24 EP disclosed