SCHEMBL11909720

SCHEMBL11909720

O=COCOC1CCCCCCC1

nearest known ligand 0.38

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 1/20 0.38
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
ADH1B P00325 2/20 0.31
ADH1C P00326 2/20 0.31
ADH1A P07327 2/20 0.31
ADH4 P08319 2/20 0.31
HPGD P15428 1/20 0.31
ADH7 P40394 1/20 0.31
EPHX1 P07099 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL72977 1.00 NPC1 (0.38) NPC1CA1CA2ADH1BADH1C
SCHEMBL9035182 1.00 NPC1 (0.38) NPC1CA1CA2ADH1BADH1C
SCHEMBL6987461 0.98 NPC1 (0.34) NPC1
SCHEMBL9036075 0.88
SCHEMBL4952178 0.82 NPC1 (0.34) NPC1HPGD
SCHEMBL73235 0.80 NPC1 (0.45) NPC1CA1CA2ADH1BADH1C
SCHEMBL8802672 0.80 NPC1 (0.45) NPC1CA1CA2ADH1BADH1C
SCHEMBL25700953 0.78 SLC6A2 (0.33)
SCHEMBL112607 0.78
SCHEMBL9517342 0.77 NPC1 (0.48) NPC1CA1CA2HPGDEPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11886119-B2 Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate MITSUI CHEMICALS, INC. (JP) 2024-01-30 US disclosed
CN-110709774-B Underlayer film forming material, resist underlayer film, method for producing resist underlayer film, and laminate 三井化学株式会社 2023-12-08 CN disclosed
US-20230185195-A1 MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2023-06-15 US disclosed
US-11599025-B2 Resin material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate MITSUI CHEMICALS, INC. (JP) 2023-03-07 US disclosed
US-20200264511-A1 MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2020-08-20 US disclosed
EP-3693793-A1 RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT Mitsui Chemicals, Inc. (JP) 2020-08-12 EP disclosed
US-20200241419-A1 RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2020-07-30 US disclosed
CN-111183395-A Resin material for forming underlayer film, resist underlayer film, method for producing resist underlayer film, and laminate 三井化学株式会社 2020-05-19 CN disclosed
CN-110709774-A Material for forming underlayer film, resist underlayer film, method for producing resist underlayer film, and laminate 三井化学株式会社 2020-01-17 CN disclosed
US-8450440-B2 Method for purifying polymer and polymer MITSUI CHEMICALS, INC. (JP) 2013-05-28 US disclosed
US-20120208976-A1 METHOD FOR PURIFYING POLYMER AND POLYMER MITSUI CHEMICALS, INC (JP) 2012-08-16 US disclosed