SCHEMBL11920239

SCHEMBL11920239

CCC(C)(CC(O)COc1ccc(C(C)(C)c2ccc(OC(C)(CC)CC3CO3)cc2)cc1)Oc1ccc(C(C)(C)c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.56
KMT2A Q03164 5/20 0.56
MAPT P10636 4/20 0.56
MEN1 O00255 4/20 0.56
TP53 P04637 3/20 0.56
TSHR P16473 3/20 0.56
HPGD P15428 3/20 0.56
HIF1A Q16665 3/20 0.56
CYP1A2 P05177 1/20 0.56
PPARG P37231 1/20 0.56
HTT P42858 2/20 0.41
AR P10275 1/20 0.41
TDP1 Q9NUW8 1/20 0.35
KDM4E B2RXH2 2/20 0.35
PKM P14618 2/20 0.34
LMNA P02545 2/20 0.34
GAA P10253 2/20 0.34
RECQL P46063 1/20 0.34
MITF O75030 1/20 0.33
MAPK1 P28482 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13783651 0.95 ALDH1A1 (0.60) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL24742917 0.94 ALDH1A1 (0.54) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL18087501 0.94 ALDH1A1 (0.54) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL21064095 0.94 ALDH1A1 (0.54) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL25747789 0.92 KMT2A (0.56) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL20647773 0.92 KMT2A (0.51) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL23837201 0.91 KMT2A (0.55) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL18844745 0.90 MEN1 (0.42) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL20244248 0.89 ALDH1A1 (0.53) ALDH1A1KMT2AMAPTMEN1TP53
SCHEMBL25747793 0.89 ALDH1A1 (0.52) ALDH1A1KMT2AMAPTMEN1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023140256-A1 MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 三菱ケミカル株式会社 2023-07-27 WO disclosed
US-10392516-B2 Fire protection composition and use thereof HILTI AKTIENGESELLSCHAFT (LI) 2019-08-27 US disclosed
US-10287420-B2 Thermal expansion resin composition SEKISUI CHEMICAL CO., LTD. (JP) 2019-05-14 US disclosed
US-10221090-B2 Transparent substrate NITTO DENKO CORPORATION (JP) 2019-03-05 US disclosed
US-20170130068-A1 Fireprotection Composition and Use Thereof HILTI AKTIENGESELLSCHAFT (LI) 2017-05-11 US disclosed
US-8241735-B2 Substrate for display device and method of manufacturing the same NITTO DENKO CORPORATION (JP) 2012-08-14 US disclosed