SCHEMBL23837201

SCHEMBL23837201

CCCOc1ccc(C(C)(C)c2ccc(OCC(O)CC(C)(CC)Oc3ccc(C(C)(C)c4ccc(OCC5CO5)cc4)cc3)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 7/20 0.55
MEN1 O00255 6/20 0.55
ALDH1A1 P00352 4/20 0.55
MAPT P10636 3/20 0.55
TP53 P04637 2/20 0.55
HPGD P15428 2/20 0.55
TSHR P16473 2/20 0.55
HIF1A Q16665 2/20 0.55
CYP1A2 P05177 1/20 0.55
PPARG P37231 1/20 0.55
HTT P42858 3/20 0.43
AR P10275 1/20 0.40
TDP1 Q9NUW8 1/20 0.34
LMNA P02545 2/20 0.34
HSD17B10 Q99714 1/20 0.34
KDM4E B2RXH2 3/20 0.34
GAA P10253 2/20 0.34
PKM P14618 2/20 0.34
ADRB2 P07550 1/20 0.34
ADRB1 P08588 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25747789 0.91 KMT2A (0.56) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL11920239 0.91 ALDH1A1 (0.56) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL18087501 0.89 ALDH1A1 (0.54) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL24742917 0.89 ALDH1A1 (0.54) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL25979833 0.89 KMT2A (0.51) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL20244248 0.89 ALDH1A1 (0.53) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL20647773 0.87 KMT2A (0.51) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL22015031 0.87 KMT2A (0.51) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL13783651 0.86 ALDH1A1 (0.60) KMT2AMEN1ALDH1A1MAPTTP53
SCHEMBL21064095 0.85 ALDH1A1 (0.54) KMT2AMEN1ALDH1A1MAPTTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3882303-A1 HEAT-CURABLE MOLDING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, HEAT-CURABLE EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED PLASTIC, PRODUCTION METHOD FOR HEAT-CURABLE MOLDING MATERIAL, AND FIBER-REINFORCED PLASTIC Mitsubishi Chemical Corporation (JP) 2021-09-22 EP disclosed