Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PIM1 | P11309 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | APP | P05067 | 2/20 | 0.38 |
| ▸ | MAPT | P10636 | 2/20 | 0.38 |
| ▸ | HPGD | P15428 | 2/20 | 0.38 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.38 |
| ▸ | RECQL | P46063 | 2/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.38 |
| ▸ | THRB | P10828 | 1/20 | 0.38 |
| ▸ | CASP1 | P29466 | 1/20 | 0.38 |
| ▸ | SNCA | P37840 | 1/20 | 0.38 |
| ▸ | AURKA | O14965 | 1/20 | 0.33 |
| ▸ | CYP1A1 | P04798 | 1/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | CDC25B | P30305 | 1/20 | 0.33 |
| ▸ | TXNRD1 | Q16881 | 1/20 | 0.33 |
| ▸ | TXNRD3 | Q86VQ6 | 1/20 | 0.33 |
| ▸ | COPS5 | Q92905 | 1/20 | 0.33 |
| ▸ | AURKB | Q96GD4 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30727795 | 1.00 | PIM1 (0.47) | PIM1HSD17B10TSHRAPPMAPT | |
| SCHEMBL25122116 | 0.82 | PIM1 (0.38) | PIM1HSD17B10TSHRAPPMAPT | |
| SCHEMBL29441209 | 0.79 | PIM1 (0.69) | PIM1HSD17B10TSHRAPPMAPT | |
| SCHEMBL338244 | 0.79 | PIM1 (0.69) | PIM1HSD17B10TSHRAPPMAPT | |
| SCHEMBL1500325 | 0.79 | GAA (0.30) | MAPT | |
| SCHEMBL119729 | 0.71 | RECQL (0.58) | PIM1HSD17B10TSHRAPPMAPT | |
| Formaldehyde SCHEMBL16280219 | 0.69 | PIM1 (0.56) | PIM1HSD17B10TSHRAPPMAPT | |
| SCHEMBL13306162 | 0.68 | IDO1 (0.33) | HSD17B10TSHRAPPMAPTHPGD | |
| SCHEMBL25122119 | 0.66 | NQO2 (0.35) | HSD17B10TSHRAPPMAPTHPGD | |
| SCHEMBL13318281 | 0.63 | ENPP2 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 131 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250163200-A1 | DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM | NIPPON SODA CO., LTD. (JP) | 2025-05-22 | — | — | US | disclosed |
| EP-4501994-A1 | DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM | Nippon Soda Co., Ltd. (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-20240409674-A1 | NOVEL POLYMER, RESIN COMPOSITION INCLUDING SAME, AND MOLDED BODY THEREOF | NIPPON SODA CO., LTD. (JP) | 2024-12-12 | — | — | US | disclosed |
| US-20240309138-A1 | NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF | NIPPON SODA CO., LTD. (JP) | 2024-09-19 | — | — | US | disclosed |
| US-12024590-B2 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2024-07-02 | — | — | US | disclosed |
| EP-4372019-A1 | NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME, AND MOLDED BODY THEREOF | Nippon Soda Co., Ltd. (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4372015-A1 | NOVEL POLYMER, RESIN COMPOSITION INCLUDING SAME, AND MOLDED BODY THEREOF | Nippon Soda Co., Ltd. (JP) | 2024-05-22 | — | — | EP | disclosed |
| CN-117597372-A | Novel (meth) acrylamide polymer, resin composition containing the same, and molded article thereof | 日本曹达株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-117597371-A | Novel polymer, resin composition containing the same, and molded article thereof | 日本曹达株式会社 | 2024-02-23 | — | — | CN | disclosed |
| US-20230400769-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2023-12-14 | — | — | US | disclosed |
| US-20110033803-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20110033803-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20100304297-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-12-02 | — | — | US | disclosed |
| US-20100304297-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-12-02 | — | — | US | disclosed |
| US-20100159392-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100159392-A1 | PATTERNING PROCESS AND RESIST COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100159404-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100159404-A1 | PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100055621-A1 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-04 | — | — | US | disclosed |
| US-20100055621-A1 | Patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-03-04 | — | — | US | disclosed |