SCHEMBL12039628

SCHEMBL12039628

CO[Si](C)(C)CCCSCCC(=O)OCCOc1ccc(C(C)(C)c2ccc(OCCOC(=O)CCSCCC[Si](C)(OC)OC)cc2)cc1

nearest known ligand 0.38

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PLA2G4B P0C869 1/20 0.38
ALDH1A1 P00352 9/20 0.37
KDM4E B2RXH2 8/20 0.37
LMNA P02545 3/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
MEN1 O00255 5/20 0.36
KMT2A Q03164 5/20 0.36
HTT P42858 2/20 0.36
POLB P06746 4/20 0.35
TDP1 Q9NUW8 1/20 0.35
GAA P10253 1/20 0.33
MAPT P10636 2/20 0.33
NPSR1 Q6W5P4 1/20 0.33
RAB9A P51151 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11911420 0.96 PLA2G4B (0.40) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2
SCHEMBL14438132 0.89 THRB (0.41) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2
SCHEMBL12020574 0.86 PLA2G4B (0.41) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2
SCHEMBL15024925 0.85 PLA2G4B (0.38) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2
SCHEMBL9881102 0.81 PLA2G4B (0.42) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2
SCHEMBL12047397 0.80 PLA2G4B (0.46) PLA2G4BKDM4ELMNASMN1; SMN2
SCHEMBL9923594 0.78 PLA2G4B (0.33) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2
SCHEMBL10424987 0.75 SMN1; SMN2 (0.47) ALDH1A1KDM4ELMNASMN1; SMN2MEN1
SCHEMBL13260880 0.73 PLA2G4B (0.39) PLA2G4BALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL2616669 0.73 PLA2G4B (0.44) PLA2G4BALDH1A1KDM4ELMNASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8431637-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, process for producing relief printing plate and relief printing plate FUJIFILM CORPORATION (JP) 2013-04-30 US disclosed
US-20110318537-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2011-12-29 US disclosed