SCHEMBL12047397

SCHEMBL12047397

CCCCSCCC(=O)OCCOc1ccc(Cc2ccc(OCCOC(=O)CCSCCC[Si](C)(OC)OC)cc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PLA2G4B P0C869 5/20 0.46
LTA4H P09960 10/20 0.41
KDM4E B2RXH2 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP2D6 P10635 1/20 0.39
PDE4A P27815 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
HIF1A Q16665 1/20 0.39
HDAC10 Q969S8 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
LMNA P02545 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11911420 0.83 PLA2G4B (0.40) PLA2G4BKDM4ESMN1; SMN2LMNA
SCHEMBL12047391 0.82 DGKA (0.41) PLA2G4BLMNA
SCHEMBL12047392 0.81 PLA2G4B (0.42) PLA2G4B
SCHEMBL12039628 0.80 PLA2G4B (0.38) PLA2G4BKDM4ESMN1; SMN2LMNA
SCHEMBL14438132 0.77 THRB (0.41) PLA2G4BKDM4ESMN1; SMN2LMNA
SCHEMBL2616669 0.74 PLA2G4B (0.44) PLA2G4BKDM4ECYP1A2CYP2D6SMN1; SMN2
SCHEMBL12891469 0.74 PLA2G4B (0.55) PLA2G4BLTA4HKDM4ELMNA
SCHEMBL12020574 0.73 PLA2G4B (0.41) PLA2G4BKDM4ESMN1; SMN2LMNA
SCHEMBL15024925 0.72 PLA2G4B (0.38) PLA2G4BKDM4ESMN1; SMN2LMNA
SCHEMBL12879972 0.72 PLA2G4B (0.42) PLA2G4BSMN1; SMN2LMNAL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8563668-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, and process for making relief printing plate FUJIFILM CORPORATION (JP) 2013-10-22 US disclosed
US-20110319563-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2011-12-29 US disclosed