⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL909714 | 0.82 | — | — | |
| SCHEMBL1532621 | 0.72 | TSHR (0.33) | — | |
| SCHEMBL5010089 | 0.72 | TSHR (0.33) | — | |
| SCHEMBL129383 | 0.70 | — | — | |
| SCHEMBL51455 | 0.70 | — | — | |
| SCHEMBL1532557 | 0.68 | THRB (0.30) | — | |
| SCHEMBL10904232 | 0.67 | — | — | |
| SCHEMBL18813463 | 0.67 | — | — | |
| SCHEMBL72530 | 0.67 | — | — | |
| SCHEMBL6451339 | 0.67 | TSHR (0.46) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114369113-A | Methylphenyldimethoxysilane and synthetic method thereof | 武汉全福茂新材料有限公司 | 2022-04-19 | — | — | CN | claimed |
| WO-2022209064-A1 | ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022202844-A1 | ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022202845-A1 | ADHESIVE PASTE, USAGE METHOD FOR ADHESIVE PASTE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022202846-A1 | ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | リンテック株式会社 | 2022-09-29 | — | — | WO | disclosed |
| EP-3187546-B1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2022-07-13 | — | — | EP | disclosed |
| EP-3196254-B1 | CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE | LINTEC CORP (JP) | 2022-07-13 | — | — | EP | disclosed |
| US-11315899-B2 | Die bonding material, light-emitting device, and method for producing light-emitting device | LINTEC CORPORATION (JP) | 2022-04-26 | — | — | US | disclosed |
| CN-114369113-A | Methylphenyldimethoxysilane and synthetic method thereof | 武汉全福茂新材料有限公司 | 2022-04-19 | — | — | CN | disclosed |
| WO-2021060562-A1 | CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION | リンテック株式会社 | 2021-04-01 | — | — | WO | disclosed |
| EP-2546306-A1 | CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC Corporation (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20110288257-A1 | SEALING MATERIAL FOR OPTICAL ELEMENT AND SEALED OPTICAL ELEMENT | KASHIO MIKIHIRO (JP) | 2011-11-24 | — | — | US | disclosed |
| US-8026332-B2 | curable seals for optics comprising polysilsesquioxanes with a ladder structure, having excellent transparency, crack and heat resistance | LINTEC CORPORATION (JP) | 2011-09-27 | — | — | US | disclosed |
| US-20110124812-A1 | FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY | LINTEC CORPORATION (JP) | 2011-05-26 | — | — | US | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-20090005530-A1 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-20080249278-A1 | Sealing material for optical element and sealed optical element | LINTEC CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-6649212-B2 | Diepoxy containing siloxanes | GUARDIAN INDUSTRIES CORPORATION | 2003-11-18 | — | — | US | disclosed |
| US-20030020049-A1 | Modified silicon-based UV absorbers useful in crosslinkable polysiloxane coatings via sol-gel polymerization | GUARDIAN GLASS, LLC. | 2003-01-30 | — | — | US | disclosed |