SCHEMBL1224310

SCHEMBL1224310

CCCCO[Si](CCCBr)(OCCCC)OCCCC

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ADRB2 P07550 1/20 0.33
ADRB1 P08588 1/20 0.33
ADRB3 P13945 1/20 0.33
LMNA P02545 1/20 0.31
CYP3A4 P08684 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10715874 0.93 LPAR2 (0.33) LMNA
SCHEMBL320053 0.91 LMNA (0.32) ADRB2ADRB1ADRB3LMNA
SCHEMBL11805316 0.91 LPAR3 (0.36) LMNATSHR
SCHEMBL1224555 0.88
SCHEMBL1225194 0.88 ADRB2 (0.35) ADRB2ADRB1ADRB3CYP3A4TSHR
SCHEMBL15333556 0.85 ADRB2 (0.39) ADRB2ADRB1ADRB3LMNACYP3A4
SCHEMBL15333887 0.85 ADRB2 (0.39) ADRB2ADRB1ADRB3LMNACYP3A4
SCHEMBL430612 0.85 ADRB2 (0.39) ADRB2ADRB1ADRB3LMNACYP3A4
SCHEMBL26455672 0.85 LPAR3 (0.35) LMNATSHR
SCHEMBL15332691 0.83 LMNA (0.38) ADRB2ADRB1ADRB3LMNACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118580266-A Sulfur silane coupling agent containing polysulfide and continuous preparation method thereof 江西宏柏新材料股份有限公司 2024-09-03 CN disclosed
CN-106574116-B Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2020-07-14 CN disclosed
EP-2963088-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORP (JP) 2020-06-10 EP disclosed
US-10266734-B2 Curable composition, cured product, method for using curable composition, and optical device LINTEC CORPORATION (JP) 2019-04-23 US disclosed
EP-3187547-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORP (JP) 2018-12-05 EP disclosed
EP-3260515-A1 POLISHING COMPOSITION Fujimi Incorporated (JP) 2017-12-27 EP disclosed
US-9783715-B2 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body LINTEC CORPORATION (JP) 2017-10-10 US disclosed
US-20170275513-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORPORATION (JP) 2017-09-28 US disclosed
EP-3187547-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE Lintec Corporation (JP) 2017-07-05 EP disclosed
US-20160288289-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2016-10-06 US disclosed
US-20160009970-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORPORATION (JP) 2016-01-14 US disclosed
EP-2963088-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY Lintec Corporation (JP) 2016-01-06 EP disclosed
EP-2546306-B1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORP (JP) 2015-05-27 EP disclosed
US-8703880-B2 Curable composition, cured product, and method for using of curable composition LINTEC CORPORATION (JP) 2014-04-22 US disclosed
US-8507044-B2 Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device LINTEC CORPORATION (JP) 2013-08-13 US disclosed
US-20130035455-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION LINTEC CORPORATION (JP) 2013-02-07 US disclosed
US-8357261-B2 Adhesive mainly composed of polyorganosiloxane compound LINTEC CORPORATION (JP) 2013-01-22 US disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 EP disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed