Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1225292 | 0.83 | SMN1; SMN2 (0.36) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL3058883 | 0.77 | SMN1; SMN2 (0.34) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL1225396 | 0.77 | ALDH1A1 (0.36) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL3064693 | 0.77 | SMN1; SMN2 (0.34) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL202905 | 0.77 | SMN1; SMN2 (0.34) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL3049482 | 0.74 | SMN1; SMN2 (0.32) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL3066090 | 0.74 | SMN1; SMN2 (0.32) | ALDH1A1TDP1SMN1; SMN2 | |
| Ether SCHEMBL27876687 | 0.72 | SMN1; SMN2 (0.35) | ALDH1A1TDP1SMN1; SMN2 | |
| Ether SCHEMBL27590127 | 0.72 | SMN1; SMN2 (0.35) | ALDH1A1TDP1SMN1; SMN2 | |
| SCHEMBL1223763 | 0.71 | SMN1; SMN2 (0.56) | ALDH1A1TDP1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112961610-B | Pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet | 琳得科株式会社 | 2023-07-18 | — | — | CN | disclosed |
| CN-112961610-A | Pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet | 琳得科株式会社 | 2021-06-15 | — | — | CN | disclosed |
| CN-104232016-B | The main binding agent being made up of polyorganosiloxane compounds | LINTEC CORP. (JP) | 2017-01-04 | — | — | CN | disclosed |
| CN-104212409-B | The main binding agent being made up of polyorganosiloxane compounds | 琳得科株式会社 | 2016-08-24 | — | — | CN | disclosed |
| CN-101965387-B | Adhesive agent mainly composed of polyorganosiloxane compound | LINTEC CORP | 2015-01-07 | — | — | CN | disclosed |
| CN-104232016-A | Adhesive mainly composed of polyorganosiloxane compound | LINTEC CORP | 2014-12-24 | — | — | CN | disclosed |
| CN-104212409-A | Adhesive mainly composed of polyorganosiloxane compound | LINTEC CORP | 2014-12-17 | — | — | CN | disclosed |
| US-8728624-B2 | Fixing material comprising silane compound polymer and photonic device sealed body | LINTEC CORPORATION (JP) | 2014-05-20 | — | — | US | disclosed |
| US-8507044-B2 | Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device | LINTEC CORPORATION (JP) | 2013-08-13 | — | — | US | disclosed |
| US-8481669-B2 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2013-07-09 | — | — | US | disclosed |
| US-20130096253-A1 | FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY | LINTEC CORPORATION (JP) | 2013-04-18 | — | — | US | disclosed |
| US-8357261-B2 | Adhesive mainly composed of polyorganosiloxane compound | LINTEC CORPORATION (JP) | 2013-01-22 | — | — | US | disclosed |
| US-20110288257-A1 | SEALING MATERIAL FOR OPTICAL ELEMENT AND SEALED OPTICAL ELEMENT | KASHIO MIKIHIRO (JP) | 2011-11-24 | — | — | US | disclosed |
| US-8026332-B2 | curable seals for optics comprising polysilsesquioxanes with a ladder structure, having excellent transparency, crack and heat resistance | LINTEC CORPORATION (JP) | 2011-09-27 | — | — | US | disclosed |
| US-20110124812-A1 | FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY | LINTEC CORPORATION (JP) | 2011-05-26 | — | — | US | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| CN-101965387-A | Adhesive agent mainly composed of polyorganosiloxane compound | LINTEC CORP | 2011-02-02 | — | — | CN | disclosed |
| US-20090005530-A1 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-20080249278-A1 | Sealing material for optical element and sealed optical element | LINTEC CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |