SCHEMBL1225403

SCHEMBL1225403

CCCO[Si](CCCOC(C)OCC)(OCCC)OCCC

nearest known ligand 0.44

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3214354 0.89 LMNA (0.48) LMNA
SCHEMBL3222130 0.81 LMNA (0.48) LMNA
SCHEMBL3224294 0.76 LMNA (0.31) LMNA
SCHEMBL1426655 0.75 LMNA (0.63) LMNA
SCHEMBL431790 0.75 LMNA (0.31) LMNA
SCHEMBL702188 0.75 LMNA (0.31) LMNA
SCHEMBL3504284 0.75
SCHEMBL729827 0.74
SCHEMBL3805511 0.74
SCHEMBL10004751 0.73 LMNA (0.60) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106574116-B Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2020-07-14 CN disclosed
EP-2963088-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORP (JP) 2020-06-10 EP disclosed
US-10266734-B2 Curable composition, cured product, method for using curable composition, and optical device LINTEC CORPORATION (JP) 2019-04-23 US disclosed
EP-3187547-B1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORP (JP) 2018-12-05 EP disclosed
US-9783715-B2 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body LINTEC CORPORATION (JP) 2017-10-10 US disclosed
US-20170275513-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE LINTEC CORPORATION (JP) 2017-09-28 US disclosed
EP-3187547-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, AND OPTICAL DEVICE Lintec Corporation (JP) 2017-07-05 EP disclosed
US-20160009970-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY LINTEC CORPORATION (JP) 2016-01-14 US disclosed
EP-2963088-A1 CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR USING CURABLE COMPOSITION, PHOTOELEMENT SEALING BODY AND METHOD FOR PRODUCING PHOTOELEMENT SEALING BODY Lintec Corporation (JP) 2016-01-06 EP disclosed
EP-2546306-B1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORP (JP) 2015-05-27 EP disclosed
US-8703880-B2 Curable composition, cured product, and method for using of curable composition LINTEC CORPORATION (JP) 2014-04-22 US disclosed
US-8507044-B2 Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device LINTEC CORPORATION (JP) 2013-08-13 US disclosed
US-8481669-B2 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2013-07-09 US disclosed
US-20130035455-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION LINTEC CORPORATION (JP) 2013-02-07 US disclosed
US-8357261-B2 Adhesive mainly composed of polyorganosiloxane compound LINTEC CORPORATION (JP) 2013-01-22 US disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 EP disclosed
US-20110054139-A1 ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND LINTEC CORPORATION (JP) 2011-03-03 US disclosed
US-20110034659-A1 MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE LINTEC CORPORATION (JP) 2011-02-10 US disclosed
US-20090005530-A1 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element LINTEC CORPORATION (JP) 2009-01-01 US disclosed