Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES1 | P23141 | 1/20 | 0.40 |
| ▸ | KCNN4 | O15554 | 4/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.34 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.34 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | KIF11 | P52732 | 2/20 | 0.32 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6293779 | 0.83 | KCNN4 (0.42) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL5701845 | 0.79 | MAPK1 (0.33) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL5701579 | 0.79 | MAPK1 (0.33) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL16144806 | 0.78 | KCNN4 (0.42) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL5701595 | 0.76 | KCNN4 (0.32) | KCNN4MAPK1ALDH1A1 | |
| SCHEMBL8072762 | 0.76 | KCNN4 (0.43) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL11409113 | 0.76 | KCNN4 (0.43) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL5643547 | 0.74 | KCNN4 (0.42) | CES1KCNN4MAPK1ALDH1A1TAAR1 | |
| SCHEMBL705543 | 0.74 | MAPK1 (0.44) | KCNN4MAPK1ALDH1A1TAAR1ALOX15 | |
| SCHEMBL109031 | 0.74 | TAAR1 (0.52) | KCNN4MAPK1ALDH1A1TAAR1ALOX15 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9546237-B2 | Stabilization of polymers that contain a hydrolyzable functionality | BRIDGESTONE CORPORATION (JP) | 2017-01-17 | — | — | US | claimed |
| EP-3864059-B1 | MODIFIED DIENE COPOLYMERS WITH TARGETED AND STABILIZED VISCOSITY | FIRESTONE POLYMERS LLC (US) | 2026-01-14 | — | — | EP | disclosed |
| US-20250179221-A1 | HIGHLY FUNCTIONALIZED STABLE HYDROCARBYLOXYSILYL POLYDIENES AND POLYDIENE COPOLYMERS | BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC | 2025-06-05 | — | — | US | disclosed |
| US-20250092168-A1 | HIGHLY FUNCTIONALIZED STABLE DIHYDROCARBYLOXYSILYL POLYDIENES AND POLYDIENE COPOLYMERS | BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC | 2025-03-20 | — | — | US | disclosed |
| EP-4460537-A1 | HIGHLY FUNCTIONALIZED STABLE DIHYDROCARBYLOXYSILYL POLYDIENES AND POLYDIENE COPOLYMERS | Bridgestone Americas Tire Operations, LLC (US) | 2024-11-13 | — | — | EP | disclosed |
| WO-2023158819-A1 | HIGHLY FUNCTIONALIZED STABLE HYDROCARBYLOXYSILYL POLYDIENES AND POLYDIENE COPOLYMERS | BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) | 2023-08-24 | — | — | WO | disclosed |
| WO-2023133557-A1 | HIGHLY FUNCTIONALIZED STABLE DIHYDROCARBYLOXYSILYL POLYDIENES AND POLYDIENE COPOLYMERS | BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) | 2023-07-13 | — | — | WO | disclosed |
| US-20210340286-A1 | Modified Diene Copolymers With Targeted And Stabilized Viscosity | FIRESTONE POLYMERS, LLC (US) | 2021-11-04 | — | — | US | disclosed |
| CN-109715680-B | Process for preparing high cis-1, 4-polydienes with lanthanide-based catalyst compositions | 株式会社普利司通 | 2021-10-19 | — | — | CN | disclosed |
| US-11127952-B2 | Core-shell structure and production method therefof, composition for negative electrode using the core-shell structure as negative electrode active material, negative electrode and secondary battery | JNC CORPORATION (JP) | 2021-09-21 | — | — | US | disclosed |
| EP-2546306-A1 | CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION | LINTEC Corporation (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20110288257-A1 | SEALING MATERIAL FOR OPTICAL ELEMENT AND SEALED OPTICAL ELEMENT | KASHIO MIKIHIRO (JP) | 2011-11-24 | — | — | US | disclosed |
| US-8026332-B2 | curable seals for optics comprising polysilsesquioxanes with a ladder structure, having excellent transparency, crack and heat resistance | LINTEC CORPORATION (JP) | 2011-09-27 | — | — | US | disclosed |
| US-20110124812-A1 | FIXING MATERIAL COMPRISING SILANE COMPOUND POLYMER AND PHOTONIC DEVICE SEALED BODY | LINTEC CORPORATION (JP) | 2011-05-26 | — | — | US | disclosed |
| US-20110054139-A1 | ADHESIVE MAINLY COMPOSED OF POLYORGANOSILOXANE COMPOUND | LINTEC CORPORATION (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110034659-A1 | MOLDING MATERIAL COMPOSED OF POLYORGANOSILOXANE COMPOUND, SEALING MATERIAL, AND SEALED OPTICAL DEVICE | LINTEC CORPORATION (JP) | 2011-02-10 | — | — | US | disclosed |
| US-7723444-B2 | retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-05-25 | — | — | US | disclosed |
| US-20090005530-A1 | Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element | LINTEC CORPORATION (JP) | 2009-01-01 | — | — | US | disclosed |
| US-20080249278-A1 | Sealing material for optical element and sealed optical element | LINTEC CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-20060189721-A1 | retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering | SUMITOMO BAKELITE CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |