Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL3654927 | 0.98 | MAPT (0.32) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL2720576 | 0.87 | LMNA (0.32) | — | |
| SCHEMBL12190388 | 0.86 | DYRK3 (0.32) | — | |
| SCHEMBL12190547 | 0.86 | LMNA (0.33) | — | |
| SCHEMBL2446917 | 0.79 | CYP1A2 (0.30) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL18056868 | 0.79 | CYP1A2 (0.30) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL9067248 | 0.78 | LMNA (0.36) | — | |
| SCHEMBL4177999 | 0.78 | LMNA (0.36) | — | |
| SCHEMBL12190489 | 0.78 | TSHR (0.30) | — | |
| SCHEMBL1230316 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8658346-B2 | Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-02-25 | — | — | US | disclosed |
| EP-2128193-B1 | POROUS POLYIMIDE | IBIDEN CO LTD (JP) | 2013-06-19 | — | — | EP | disclosed |
| US-8426105-B2 | Resist-modifying composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-23 | — | — | US | disclosed |
| US-8367310-B2 | Pattern forming process and resist-modifying composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-02-05 | — | — | US | disclosed |
| US-8329384-B2 | Resist-modifying composition and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-12-11 | — | — | US | disclosed |
| US-8029577-B2 | Lightening and/or dyeing of human keratin fibres via a composition comprising a particular amino silicon compound and composition and device | L'OREAL S.A. (FR) | 2011-10-04 | — | — | US | disclosed |
| US-8022110-B2 | Porous polyimide | IBIDEN CO., LTD. (JP) | 2011-09-20 | — | — | US | disclosed |
| US-7909889-B2 | Lightening and/or coloring human keratin fibers using at least one aminotrialkoxy silane or at least one aminotrialkenyloxy silane composition | L'OREAL S.A. (FR) | 2011-03-22 | — | — | US | disclosed |
| US-7905927-B2 | Method for lightening and/or coloring human keratin fibers using a composition comprising an aminotrialkoxy silane or aminotrialkenyloxy silane compound and device | L'OREAL, SA (FR) | 2011-03-15 | — | — | US | disclosed |
| US-20110033799-A1 | PATTERN FORMING PROCESS, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST-MODIFYING COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-02-10 | — | — | US | disclosed |
| EP-2128193-A1 | POROUS POLYIMIDE | Ibiden Co., Ltd. (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-1117102-B1 | Method of manufacturing material for forming insulating film | JSR CORP (JP) | 2005-08-10 | — | — | EP | disclosed |
| US-6642352-B2 | Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound | JSR CORPORATION (JP) | 2003-11-04 | — | — | US | disclosed |
| EP-0844283-B1 | Curable resin composition and cured products | JSR CORP (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-20010009936-A1 | Method of manufacturing material for forming insulating film | JSR CORPORATION (JP) | 2001-07-26 | — | — | US | disclosed |
| EP-1117102-A2 | Method of manufacturing material for forming insulating film | JSR Corporation (JP) | 2001-07-18 | — | — | EP | disclosed |
| US-6096485-A | COMPRISING AN ORGANOMETALLIC POLYMER CONTAINING AT LEAST TWO AMINOALKYLPHOSPHORIC ACID OR AMINOALKYLPHOSPHONIC ACID STRUCTURAL UNITS OF GIVEN FORMULA; CHELATE ZINC IONS; NONPOLLUTING, STORAGE STABILITY | FUJI PHOTO FILM CO., LTD. (JP) | 2000-08-01 | — | — | US | disclosed |
| US-6011123-A | ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. | JSR CORPORATION (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0844283-A1 | Curable resin composition and cured products | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-27 | — | — | EP | disclosed |