Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.30 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.30 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.30 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12794775 | 0.87 | — | — | |
| SCHEMBL18056868 | 0.82 | CYP1A2 (0.30) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL12794879 | 0.79 | TRPA1 (0.31) | TRPA1 | |
| SCHEMBL1229264 | 0.79 | CYP1A2 (0.31) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL12794799 | 0.78 | — | — | |
| SCHEMBL1228667 | 0.78 | — | — | |
| Hydrochloric Acid SCHEMBL3654927 | 0.77 | MAPT (0.32) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL12794888 | 0.77 | — | — | |
| SCHEMBL8691101 | 0.75 | CYP1A2 (0.34) | CYP1A2CYP2D6CYP2C19 | |
| SCHEMBL57612 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128193-B1 | POROUS POLYIMIDE | IBIDEN CO LTD (JP) | 2013-06-19 | — | — | EP | disclosed |
| US-8022110-B2 | Porous polyimide | IBIDEN CO., LTD. (JP) | 2011-09-20 | — | — | US | disclosed |
| US-20100048745-A1 | POROUS POLYIMIDE | IBIDEN CO., LTD (JP) | 2010-02-25 | — | — | US | disclosed |
| EP-2128193-A1 | POROUS POLYIMIDE | Ibiden Co., Ltd. (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-0844283-B1 | Curable resin composition and cured products | JSR CORP (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-6011123-A | ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. | JSR CORPORATION (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0844283-A1 | Curable resin composition and cured products | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-27 | — | — | EP | disclosed |