Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC3 | O15379 | 4/20 | 0.73 |
| ▸ | HDAC4 | P56524 | 4/20 | 0.73 |
| ▸ | HDAC1 | Q13547 | 4/20 | 0.73 |
| ▸ | HDAC7 | Q8WUI4 | 4/20 | 0.73 |
| ▸ | HDAC2 | Q92769 | 4/20 | 0.73 |
| ▸ | HDAC10 | Q969S8 | 4/20 | 0.73 |
| ▸ | HDAC11 | Q96DB2 | 4/20 | 0.73 |
| ▸ | HDAC8 | Q9BY41 | 4/20 | 0.73 |
| ▸ | HDAC6 | Q9UBN7 | 4/20 | 0.73 |
| ▸ | HDAC9 | Q9UKV0 | 4/20 | 0.73 |
| ▸ | HDAC5 | Q9UQL6 | 4/20 | 0.73 |
| ▸ | SIRT2 | Q8IXJ6 | 4/20 | 0.65 |
| ▸ | RAB9A | P51151 | 4/20 | 0.54 |
| ▸ | NPC1 | O15118 | 3/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.54 |
| ▸ | SIRT1 | Q96EB6 | 1/20 | 0.48 |
| ▸ | SIRT3 | Q9NTG7 | 1/20 | 0.48 |
| ▸ | MGAM | O43451 | 3/20 | 0.48 |
| ▸ | AMY1A | P0DUB6 | 3/20 | 0.48 |
| ▸ | GAA | P10253 | 3/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1779820 | 0.92 | HDAC3 (0.74) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL7413562 | 0.90 | HDAC3 (0.71) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL69680 | 0.87 | HDAC3 (0.63) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL4953766 | 0.87 | HDAC3 (0.80) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL4868536 | 0.87 | HDAC3 (0.71) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL2298574 | 0.87 | HDAC3 (0.71) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL6539230 | 0.87 | HDAC3 (0.80) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL8827885 | 0.85 | HDAC3 (0.68) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL7317724 | 0.85 | HDAC3 (1.00) | HDAC3HDAC4HDAC1HDAC7HDAC2 | |
| SCHEMBL69679 | 0.84 | HDAC3 (0.69) | HDAC3HDAC4HDAC1HDAC7HDAC2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1630605-B1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-10-11 | — | — | EP | disclosed |
| EP-1209523-B1 | Composition of positive photosensitive resin precursor, and display device made thereof | TORAY INDUSTRIES (JP) | 2015-08-26 | — | — | EP | disclosed |
| EP-1508837-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES (JP) | 2014-10-15 | — | — | EP | disclosed |
| US-7977400-B2 | polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation | TORAY INDUSTRIES, INC. (JP) | 2011-07-12 | — | — | US | disclosed |
| US-7977400-B2 | polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation | TORAY INDUSTRIES, INC. (JP) | 2011-07-12 | — | — | US | disclosed |
| US-7476476-B2 | Photosensitive resin composition, electronic component using the same, and display unit using the same | TORAY INDUSTRIES, INC. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-20080108723-A1 | Photosensitive Resin Composition | TORAY INDUSTRIES, INC. (JP) | 2008-05-08 | — | — | US | disclosed |
| US-20080108723-A1 | Photosensitive Resin Composition | TORAY INDUSTRIES, INC. (JP) | 2008-05-08 | — | — | US | disclosed |
| EP-1862855-A1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2007-12-05 | — | — | EP | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |