Sulfuric Acid

Sulfuric Acid

SCHEMBL1243527

O=S(=O)(O)O.[Ni].[Ni]

nearest known ligand 0.00

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Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL35545 1.00
Sulfuric Acid SCHEMBL28622682 1.00 CA5A (0.86)
Sulfuric Acid SCHEMBL8002797 1.00 CA5A (0.86)
Sulfuric Acid SCHEMBL5326498 1.00 CA5A (0.86)
Sulfuric Acid SCHEMBL25235566 0.94
Sulfuric Acid SCHEMBL6877015 0.94 CA5A (0.75)
Sulfuric Acid SCHEMBL4959323 0.94 CA5A (0.75)
Sulfuric Acid SCHEMBL5445978 0.94
Sulfuric Acid SCHEMBL1261850 0.94
Sulfuric Acid SCHEMBL10617242 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113603474-A Preparation method of transparent ceramic optical fiber with core-spun structure 南通大学 2021-11-05 CN claimed
CN-109881001-A The method of tin material is extracted in a kind of tin ore 柳州光华科技有限公司 2019-06-14 CN claimed
CN-106413952-B The manufacturing method of nickel powder 国立大学法人高知大学 2019-01-08 CN claimed
CN-108998778-A A kind of preparation method and conductive sponge of conductive sponge 胡海 2018-12-14 CN claimed
CN-107760157-A A kind of preparation method of the corrosion-resistant epoxy paint of conductive energy 成都森钰泓绿化工程有限公司 2018-03-06 CN claimed
CN-107675199-A The technique that a kind of electrolysis prepares nickel sulfate 中国科学院兰州化学物理研究所 2018-02-09 CN claimed
CN-104047041-B Preparation method for printed circuit board 深圳市九和咏精密电路有限公司 2017-04-26 CN claimed
CN-106450349-A Preparation method of iron-nickel hydrotalcite structure nanosheet for oxygen evolution reaction 北京理工大学 2017-02-22 CN claimed
CN-105801179-A Direct metallization method for ceramic substrate 深圳市环基实业有限公司 2016-07-27 CN claimed
CN-105624748-A Manufacturing method of tourist souvenir ornament ZHANG YING 2016-06-01 CN claimed
CN-104060097-A Separating and recycling method of nickel, cobalt, copper manganese and zinc in electroplating sludge JIANGXI GRAND GREEN TECHNOLOGY CO LTD 2014-09-24 CN claimed
CN-119506994-A Ceramic relay shell secondary metallization nickel electroplating pretreatment process 娄底市鑫伟达金属材料有限公司 2025-02-25 CN disclosed
CN-115939928-B Heat sink structure of semiconductor laser and preparation method thereof 四川富乐华半导体科技有限公司 2023-06-16 CN disclosed
CN-115939928-A Heat sink structure of semiconductor laser and preparation method thereof 四川富乐华半导体科技有限公司 2023-04-07 CN disclosed
CN-113603474-A Preparation method of transparent ceramic optical fiber with core-spun structure 南通大学 2021-11-05 CN disclosed
US-20110094410-A1 REGENERATION APPARATUS AND REGENERATION METHOD FOR ELECTROLESS PLATING MURATA CO., LTD. (JP) 2011-04-28 US disclosed
US-7892603-B2 Regeneration apparatus and regeneration method for electroless plating MURATA CO., LTD. (JP) 2011-02-22 US disclosed
US-6156413-A Glass circuit substrate and fabrication method thereof CANON KABUSHIKI KAISHA (JP) 2000-12-05 US disclosed
US-5496509-A FIBER REINFORCED PLASTIC, INJECTION A COATING, PLATING THE SURFACE USING URETHANE ACRYLATES DAI NIPPON TORYO CO., LTD. (JP) 1996-03-05 US disclosed
US-4452858-A HIGH ADHESION OF METAL LAYER TO THE WOLLASTONITE FILLER-CONTAINING MOLDING MATERIAL TOYO BOSEKI KABUSHIKI KAISHA (JP) 1984-06-05 US disclosed