Sulfuric Acid

Sulfuric Acid

SCHEMBL1243527

O=S(=O)(O)O.[Ni].[Ni]

nearest known ligand 0.00

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Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL35545 1.00 — —
Sulfuric Acid SCHEMBL8002797 1.00 CA5A (0.86) —
Sulfuric Acid SCHEMBL28622682 1.00 CA5A (0.86) —
Sulfuric Acid SCHEMBL5326498 1.00 CA5A (0.86) —
Sulfuric Acid SCHEMBL25235566 0.94 — —
Sulfuric Acid SCHEMBL11119781 0.94 CA5A (0.75) —
Sulfuric Acid SCHEMBL10897335 0.94 — —
Sulfuric Acid SCHEMBL8390747 0.94 — —
Sulfuric Acid SCHEMBL9674208 0.94 — —
Sulfuric Acid SCHEMBL5498506 0.94 CA5A (0.75) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113603474-A Preparation method of transparent ceramic optical fiber with core-spun structure 南通大学 2021-11-05 — — CN claimed
CN-109881001-A The method of tin material is extracted in a kind of tin ore 柳州光华科技有限公司 2019-06-14 — — CN claimed
CN-106413952-B The manufacturing method of nickel powder 国立大学法人高知大学 2019-01-08 — — CN claimed
CN-108998778-A A kind of preparation method and conductive sponge of conductive sponge 胡海 2018-12-14 — — CN claimed
CN-107760157-A A kind of preparation method of the corrosion-resistant epoxy paint of conductive energy 成都森钰泓绿化工程有限公司 2018-03-06 — — CN claimed
CN-107675199-A The technique that a kind of electrolysis prepares nickel sulfate 中国科学院兰州化学物理研究所 2018-02-09 — — CN claimed
CN-104047041-B Preparation method for printed circuit board 深圳市九和咏精密电路有限公司 2017-04-26 — — CN claimed
CN-106450349-A Preparation method of iron-nickel hydrotalcite structure nanosheet for oxygen evolution reaction 北京理工大学 2017-02-22 — — CN claimed
CN-105801179-A Direct metallization method for ceramic substrate 深圳市环基实业有限公司 2016-07-27 — — CN claimed
CN-105624748-A Manufacturing method of tourist souvenir ornament ZHANG YING 2016-06-01 — — CN claimed
CN-104060097-A Separating and recycling method of nickel, cobalt, copper manganese and zinc in electroplating sludge JIANGXI GRAND GREEN TECHNOLOGY CO LTD 2014-09-24 — — CN claimed
CN-119506994-A Ceramic relay shell secondary metallization nickel electroplating pretreatment process 娄底市鑫伟达金属材料有限公司 2025-02-25 — — CN disclosed
CN-115939928-B Heat sink structure of semiconductor laser and preparation method thereof 四川富乐华半导体科技有限公司 2023-06-16 — — CN disclosed
CN-115939928-A Heat sink structure of semiconductor laser and preparation method thereof 四川富乐华半导体科技有限公司 2023-04-07 — — CN disclosed
CN-113603474-A Preparation method of transparent ceramic optical fiber with core-spun structure 南通大学 2021-11-05 — — CN disclosed
US-20110094410-A1 REGENERATION APPARATUS AND REGENERATION METHOD FOR ELECTROLESS PLATING MURATA CO., LTD. (JP) 2011-04-28 — — US disclosed
US-7892603-B2 Regeneration apparatus and regeneration method for electroless plating MURATA CO., LTD. (JP) 2011-02-22 — — US disclosed
US-6156413-A Glass circuit substrate and fabrication method thereof CANON KABUSHIKI KAISHA (JP) 2000-12-05 — — US disclosed
US-5496509-A FIBER REINFORCED PLASTIC, INJECTION A COATING, PLATING THE SURFACE USING URETHANE ACRYLATES DAI NIPPON TORYO CO., LTD. (JP) 1996-03-05 — — US disclosed
US-4452858-A HIGH ADHESION OF METAL LAYER TO THE WOLLASTONITE FILLER-CONTAINING MOLDING MATERIAL TOYO BOSEKI KABUSHIKI KAISHA (JP) 1984-06-05 — — US disclosed
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