SCHEMBL1245562

SCHEMBL1245562

CCCCOC(CO)CC(O)CO

nearest known ligand 0.49

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 5/20 0.46
CNR1 P21554 4/20 0.46
ALDH1A1 P00352 1/20 0.46
USP2 O75604 1/20 0.44
DNM1 Q05193 1/20 0.38
LPAR1 Q92633 6/20 0.37
LPAR3 Q9UBY5 6/20 0.37
LPAR2 Q9HBW0 3/20 0.37
LPAR6 P43657 2/20 0.37
LPAR4 Q99677 2/20 0.37
LPAR5 Q9H1C0 2/20 0.37
KDM4E B2RXH2 1/20 0.36
DUSP3 P51452 1/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7085999 0.87 CNR2 (0.42) CNR2CNR1ALDH1A1USP2DNM1
SCHEMBL10494939 0.87 DNM1 (0.47) CNR2CNR1ALDH1A1USP2DNM1
SCHEMBL25206321 0.85 USP2 (0.56) CNR2CNR1ALDH1A1USP2LPAR1
SCHEMBL8099005 0.84 USP2 (0.50) CNR2CNR1ALDH1A1USP2LPAR1
SCHEMBL709665 0.83 CNR2 (0.60) CNR2CNR1ALDH1A1DNM1LPAR1
SCHEMBL2348818 0.81 USP2 (0.59) CNR2CNR1ALDH1A1USP2LPAR1
SCHEMBL223184 0.79 CNR2 (0.52) CNR2CNR1ALDH1A1DNM1LPAR1
SCHEMBL548775 0.79 CNR2 (0.52) CNR2CNR1ALDH1A1DNM1LPAR1
SCHEMBL2170254 0.79 LMNA (0.36) ALDH1A1
SCHEMBL6856831 0.79 LMNA (0.36) ALDH1A1USP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140364352-A1 Material Release System HAVILAND PRODUCTS COMPANY (US) 2014-12-11 US claimed
US-7887693-B2 containing improved additive system for use at elevated temperatures comprising a suppressor including a high molecular weight polymer, a brightener comprising a divalent sulfur compound, and a leveler comprising a heterocyclic nitrogen compound; for plating through holes in printed circuits CITIBANK, N.A. 2011-02-15 US claimed
WO-2009121148-A1 DYE COMPRISING FUNCTIONAL SUBSTITUENT ADVANCED POLYMERIK PTY LTD (AU) 2009-10-08 WO claimed
US-20080314757-A1 Acid copper electroplating bath composition CITIBANK, N.A. 2008-12-25 US claimed
EP-1596831-A2 MATERIAL INCAPSULATION SYSTEM Venture Management Alliance, LLC (US) 2005-11-23 EP claimed
WO-2004073033-A2 MATERIAL INCAPSULATION SYSTEM VENTURE MANAGEMENT ALLIANCE, LLC (US) 2004-08-26 WO claimed
US-20140364352-A1 Material Release System HAVILAND PRODUCTS COMPANY (US) 2014-12-11 US disclosed
US-8834934-B2 Material encapsulation system HAVILAND PRODUCTS COMPANY (US) 2014-09-16 US disclosed
US-7887693-B2 containing improved additive system for use at elevated temperatures comprising a suppressor including a high molecular weight polymer, a brightener comprising a divalent sulfur compound, and a leveler comprising a heterocyclic nitrogen compound; for plating through holes in printed circuits CITIBANK, N.A. 2011-02-15 US disclosed
WO-2009121148-A1 DYE COMPRISING FUNCTIONAL SUBSTITUENT ADVANCED POLYMERIK PTY LTD (AU) 2009-10-08 WO disclosed
US-20080314757-A1 Acid copper electroplating bath composition CITIBANK, N.A. 2008-12-25 US disclosed
US-7253229-B2 Polymer-bonded functional agents DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 2007-08-07 US disclosed
EP-1067144-B1 Polymer-bonded functional agents DAINICHISEIKA COLOR CHEM (JP) 2006-10-25 EP disclosed
US-20050230319-A1 Water-soluble copolymer, polymeric flocculant, and method of dehydrating sludge TOAGOSEI CO., LTD. (JP) 2005-10-20 US disclosed
US-20050226835-A1 Polymer-bonded functional agents DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 2005-10-13 US disclosed
US-6936659-B2 Polymer-bonded functional agents DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 2005-08-30 US disclosed
EP-1479703-A1 WATER-SOLUBLE COPOLYMER, POLYMERIC FLOCCULANT, AND METHOD OF DEHYDRATING SLUDGE TOAGOSEI CO., LTD. (JP) 2004-11-24 EP disclosed
WO-2004073033-A2 MATERIAL INCAPSULATION SYSTEM VENTURE MANAGEMENT ALLIANCE, LLC (US) 2004-08-26 WO disclosed
US-20030078346-A1 Polymer-bonded functional agents DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) 2003-04-24 US disclosed
EP-1067144-A1 Polymer-bonded functional agents DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) 2001-01-10 EP disclosed