SCHEMBL12468804

SCHEMBL12468804

COS(c1ccccc1)(c1ccccc1)c1ccc(C(=O)OC(C)(C)C)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 1/20 0.54
CA1 P00915 1/20 0.54
CA2 P00918 1/20 0.54
CA9 Q16790 1/20 0.54
CA14 Q9ULX7 1/20 0.54
STAT3 P40763 2/20 0.45
ALDH1A1 P00352 3/20 0.44
TSHR P16473 2/20 0.44
HSD17B10 Q99714 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
ABCG2 Q9UNQ0 1/20 0.42
KDM4E B2RXH2 1/20 0.40
GAA P10253 1/20 0.40
PKM P14618 1/20 0.40
HPGD P15428 1/20 0.40
MAPT P10636 2/20 0.39
CYP1A2 P05177 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C19 P33261 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3206672 0.88 STAT3 (0.43) CA12CA1CA2CA9CA14
SCHEMBL3181652 0.83 ALDH1A1 (0.43) CA12CA1CA2CA9CA14
SCHEMBL9947578 0.83 CA12 (0.41) CA12CA1CA2CA9CA14
SCHEMBL3195183 0.82 CA12 (0.37) CA12CA1CA2CA9CA14
SCHEMBL3194042 0.81 CA12 (0.39) CA12CA1CA2CA9CA14
Hydrogen Peroxide SCHEMBL28474133 0.79 TDP1 (0.64) CA12CA1CA2CA9CA14
Hydrogen Peroxide SCHEMBL28425777 0.79 TDP1 (0.64) CA12CA1CA2CA9CA14
SCHEMBL29199324 0.79 TDP1 (0.64) CA12CA1CA2CA9CA14
SCHEMBL260960 0.79 TDP1 (0.64) CA12CA1CA2CA9CA14
SCHEMBL3189653 0.79 ALOX15 (0.37) CA12CA1CA2CA9CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103781813-B The epoxy resin adduct mixed 蓝立方知识产权有限责任公司 2016-09-14 CN disclosed
EP-2621997-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
WO-2012050777-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-19 WO disclosed
CN-100507716-C Chemical amplification type positive resist composition, resist laminated material, resist pattern forming method and method of manufacturing semiconductor device TOYKO OHKA KOGYO CO LTD (JP) 2009-07-01 CN disclosed
CN-1311298-C Photoresist composition, laminated material, pattern forming method and method for manufacturing semiconductor device TOKYO OHKA KOGYO CO LTD (JP) 2007-04-18 CN disclosed
CN-1740911-A Chemical amplification type positive resist composition, resist laminated material, resist pattern forming method and method of manufacturing semiconductor device TOYKO OHKA KOGYO CO LTD (JP) 2006-03-01 CN disclosed
CN-1520534-A Photoresist composition, laminated material, pattern forming method and method for manufacturing semiconductor device ͬ�Ϳ�ҵ��ʽ���� 2004-08-11 CN disclosed