Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 2/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | FFAR3 | O14843 | 3/20 | 0.41 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.41 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.41 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.41 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.41 |
| ▸ | CA1 | P00915 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | BBOX1 | O75936 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | CASP1 | P29466 | 1/20 | 0.32 |
| ▸ | CES2 | O00748 | 1/20 | 0.32 |
| ▸ | CES1 | P23141 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7635410 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 | |
| SCHEMBL3802494 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 | |
| SCHEMBL22398809 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 | |
| Potassium Ion SCHEMBL14935705 | 0.94 | — | — | |
| SCHEMBL8225486 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 | |
| Lithium Ion SCHEMBL25252562 | 0.94 | — | — | |
| Zinc Ion SCHEMBL17459908 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 | |
| SCHEMBL208043 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 | |
| SCHEMBL5143342 | 0.94 | — | — | |
| SCHEMBL17433670 | 0.94 | CA4 (0.50) | CA4TDP1FFAR3HDAC3HDAC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110945080-A | Dual-curable resin composition, cured body prepared therefrom, and electronic device comprising such cured body | 美国陶氏有机硅公司 | 2020-03-31 | — | — | CN | claimed |
| CN-118271847-A | Room temperature curable organopolysiloxane composition for protecting electrical/electronic components | 陶氏东丽株式会社 | 2024-07-02 | — | — | CN | disclosed |
| EP-4370606-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | Dow Silicones Corporation (US) | 2024-05-22 | — | — | EP | disclosed |
| CN-117730123-A | Heat conductive silicone composition | 美国陶氏有机硅公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-114981336-B | Dual cure composition | 美国陶氏有机硅公司 | 2023-11-14 | — | — | CN | disclosed |
| CN-116529328-A | Method for preparing film and composition therefor | 美国陶氏有机硅公司 | 2023-08-01 | — | — | CN | disclosed |
| CN-116023895-A | UV moisture dual-curing sealant and preparation method thereof | 成都拓利科技股份有限公司 | 2023-04-28 | — | — | CN | disclosed |
| CN-114144477-B | Curable organopolysiloxane composition, cured product, and electrical/electronic device | 美国陶氏有机硅公司 | 2023-02-28 | — | — | CN | disclosed |
| CN-112272694-B | Water-based hybrid pressure sensitive adhesive composition and method of making same | 美国陶氏有机硅公司 | 2023-02-03 | — | — | CN | disclosed |
| WO-2023283819-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | DOW SILICONES CORPORATION (US) | 2023-01-19 | — | — | WO | disclosed |
| US-20160035457-A1 | FIELD EFFECT TRANSISTOR | TORAY INDUSTRIES, INC. (JP) | 2016-02-04 | — | — | US | disclosed |
| EP-2975649-A1 | FIELD EFFECT TRANSISTOR | Toray Industries, Inc. (JP) | 2016-01-20 | — | — | EP | disclosed |
| CN-101687775-B | Aldimines and compositions comprising aldamine | SIKA TECHNOLOGY AG | 2015-05-06 | — | — | CN | disclosed |
| CN-101765583-B | Aldimines comprising hydroxyl groups, and compositions containing aldimine | SIKA TECHNOLOGY AG | 2014-06-04 | — | — | CN | disclosed |
| CN-101883753-B | Aromatic aldimines and polyurethane compositions which contain aldimine | SIKA TECHNOLOGY AG | 2014-06-04 | — | — | CN | disclosed |
| US-8247516-B2 | Room-temperature curable organopolysiloxane composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2012-08-21 | — | — | US | disclosed |
| EP-2207856-B1 | ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION | DOW CORNING TORAY CO LTD (JP) | 2012-03-07 | — | — | EP | disclosed |
| US-20100236450-A1 | Room-Temperature Curable Organopolysiloxane Composition | DOW TORAY CO., LTD. (JP) | 2010-09-23 | — | — | US | disclosed |
| EP-2207856-A1 | ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2010-07-21 | — | — | EP | disclosed |
| WO-2009054279-A1 | ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2009-04-30 | — | — | WO | disclosed |