Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethane SCHEMBL5834544 | 0.97 | LMNA (0.30) | LMNA | |
| Ethylene SCHEMBL5834010 | 0.95 | — | — | |
| SCHEMBL27647099 | 0.87 | — | — | |
| SCHEMBL4077417 | 0.78 | — | — | |
| SCHEMBL1313968 | 0.78 | HSD17B10 (0.32) | — | |
| SCHEMBL29249288 | 0.78 | — | — | |
| SCHEMBL4081969 | 0.78 | — | — | |
| SCHEMBL1263425 | 0.78 | MAPK1 (0.33) | — | |
| SCHEMBL1608027 | 0.78 | TSHR (0.31) | — | |
| SCHEMBL10697771 | 0.78 | ALDH1A1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 688 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119684966-B | Hot-moisture dual-cured organic silicon sealant and preparation method thereof | 广州白云科技股份有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-120025698-A | Perfluoropolyether modified silicon dioxide material and preparation method thereof | 中石油(上海)新材料研究院有限公司 | 2025-05-23 | — | — | CN | claimed |
| CN-119736061-A | Double-component flame-retardant mildew-proof silicone sealant and manufacturing method thereof | 广东长鹿新材料科技有限公司 | 2025-04-01 | — | — | CN | claimed |
| CN-119709110-A | Rapidly-cured bi-component heat-conducting pouring sealant and preparation method thereof | 广东长鹿新材料科技有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-119684966-A | Hot-moisture dual-cured organic silicon sealant and preparation method thereof | 广州白云科技股份有限公司 | 2025-03-25 | — | — | CN | claimed |
| CN-119592295-A | High-fluidity high-strength alcohol-type transparent coating adhesive and manufacturing method thereof | 广东长鹿新材料科技有限公司 | 2025-03-11 | — | — | CN | claimed |
| EP-3307816-B1 | HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE | BISON INT B V (NL) | 2025-02-26 | — | — | EP | claimed |
| CN-118667504-A | High-strength organosilicon coating adhesive and preparation method and application thereof | 深圳市安伯斯科技有限公司 | 2024-09-20 | — | — | CN | claimed |
| CN-117844330-A | Preparation method of barrier type water-based heat insulation aerogel coating | 江西宏柏新材料股份有限公司 | 2024-04-09 | — | — | CN | claimed |
| CN-116731664-A | Double-component organic silicon pouring sealant and preparation method thereof | 深圳市安伯斯科技有限公司 | 2023-09-12 | — | — | CN | claimed |
| CN-106349277-A | Method for preparing alkoxy-terminated polymethyltrifluoropropyl siloxane oligomers | 山东大学 | 2017-01-25 | — | — | CN | claimed |
| WO-2016202359-A1 | HIGH STRENGTH AND MOISTURE RESISTANT ADHESIVE | BISON INTERNATIONAL B.V. (NL) | 2016-12-22 | — | — | WO | claimed |
| CN-105906810-A | Preparation method of organopolysiloxane resin | 广东标美硅氟新材料有限公司 | 2016-08-31 | — | — | CN | claimed |
| CN-105153831-A | Organosilane doped waterborne strippable coating and preparation method thereof | HARBIN INST OF TECHNOLOGY | 2015-12-16 | — | — | CN | claimed |
| US-8247516-B2 | Room-temperature curable organopolysiloxane composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2012-08-21 | — | — | US | claimed |
| CN-101838154-A | Organosilicon concrete protectant and preparation method thereof | JINGZHOU JIANGHAN FINE CHEMICAL CO LTD | 2010-09-22 | — | — | CN | claimed |
| US-20080283972-A1 | Silicon Compounds for Producing Sio2-Containing Insulating Layers on Chips | DEGUSSA AG (DE) | 2008-11-20 | — | — | US | claimed |
| EP-1716269-A2 | PROCESS FOR PRODUCING SIO2-CONTAINING INSULATING LAYERS ON CHIPS | Degussa GmbH (DE) | 2006-11-02 | — | — | EP | claimed |
| CN-1813011-A | Polymerization catalyst system using di-se-butyl dimethyoxysilane for preparation of polypropylene | FINA TECHNOLOGY (US) | 2006-08-02 | — | — | CN | claimed |
| WO-2005080629-A2 | SILICON COMPOUNDS FOR PRODUCING SiO2-CONTAINING INSULATING LAYERS ON CHIPS | DEGUSSA AG (DE) | 2005-09-01 | — | — | WO | claimed |