SCHEMBL1260799

SCHEMBL1260799

CC(C)C(OOC(C)(C)C)OC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1260797 0.85
SCHEMBL30457550 0.81
SCHEMBL30456850 0.80 MMP1 (0.30)
SCHEMBL9438065 0.78 TSHR (0.31)
SCHEMBL30457146 0.78
SCHEMBL30456990 0.76 LMNA (0.31)
SCHEMBL29145916 0.74 TSHR (0.39)
SCHEMBL21647402 0.73 HMGCR (0.32)
SCHEMBL6062732 0.73 TSHR (0.42)
SCHEMBL10981370 0.72 TSHR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9079998-B2 Aqueous dispersion and aqueous coating composition, and process of forming coating film KANSAI PAINT CO., LTD. (JP) 2015-07-14 US claimed
US-20110034622-A1 AQUEOUS DISPERSION AND AQUEOUS COATING COMPOSITION, AND PROCESS OF FORMING COATING FILM KANSAI PAINT CO., LTD. (JP) 2011-02-10 US claimed
EP-4692177-A1 RESIN POWDER AND METHOD FOR PRODUCING SAME Kaneka Corporation (JP) 2026-02-11 EP disclosed
US-20250388748-A1 THERMOPLASTIC RESIN COMPOSITION KANEKA CORPORATION (JP) 2025-12-25 US disclosed
EP-4610313-A1 THERMOPLASTIC RESIN COMPOSITION Kaneka Corporation (JP) 2025-09-03 EP disclosed
US-20250250435-A1 THERMOPLASTIC RESIN COMPOSITION KANEKA CORPORATION (JP) 2025-08-07 US disclosed
US-20250243321-A1 METHOD FOR PRODUCING MODIFIED ALIPHATIC OR ALIPHATIC-AROMATIC THERMOPLASTIC POLYESTER RESIN KANEKA CORPORATION (JP) 2025-07-31 US disclosed
US-20250230273-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING THE SAME KANEKA CORPORATION (JP) 2025-07-17 US disclosed
US-20250215215-A1 THERMOPLASTIC RESIN COMPOSITION KANEKA CORPORATION (JP) 2025-07-03 US disclosed
US-20250066538-A1 MODIFIED ALIPHATIC POLYESTER RESIN AND COMPOSITION OR MOLDED ARTICLE THEREOF KANEKA CORPORATION (JP) 2025-02-27 US disclosed
EP-4506395-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME Kaneka Corporation (JP) 2025-02-12 EP disclosed
CN-103946021-A Metal-clad laminate, and printed wiring board PANASONIC CORP 2014-07-23 CN disclosed
US-20140116764-A1 METAL-CLAD LAMINATE AND PRINTED WIRING BOARD PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2014-05-01 US disclosed
CN-103619580-A METAL-CLAD LAMINATE AND PRINTED WIRING BOARD MATSUSHITA ELECTRIC INDUSTRIAL CO LTD 2014-03-05 CN disclosed
US-20130319735-A1 METAL-CLAD LAMINATE AND PRINTED WIRING BOARD PANASONIC CORPORATION (JP) 2013-12-05 US disclosed
CN-103379995-A METAL-CLAD LAMINATE AND PRINTED WIRING BOARD MATSUSHITA ELECTRIC INDUSTRIAL CO LTD 2013-10-30 CN disclosed
US-6500910-B1 BOTH HIGH TRANSPARENCY AND HEAT RESISTANCE; OPTICAL FIBERS; NONCRYSTALLINE POLYMER AND A METAL CHELATE COMPOUND Koike, Yasuhiro (JP) 2002-12-31 US disclosed
EP-1072905-A1 Refractive index distribution type light transmitting device Koike, Yasuhiro (JP) 2001-01-31 EP disclosed
EP-0457275-B1 Shock-resistant vinyl-aromatic graft copolymer having improved mechanical properties ENICHEM SPA (IT) 1996-03-06 EP disclosed
EP-0457275-A2 Shock-resistant vinyl-aromatic graft copolymer having improved mechanical properties ENICHEM S.p.A. (IT) 1991-11-21 EP disclosed