SCHEMBL12677510

SCHEMBL12677510

CCC(C)C(=O)OC1CC2CC1CC2CN

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
▸ HMGCR P04035 2/20 0.31
▸ SLCO1B1 Q9Y6L6 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17409239 0.83 HMGCR (0.30) HMGCR
SCHEMBL15120004 0.81 — —
SCHEMBL1628314 0.80 — —
SCHEMBL12198853 0.80 HMGCR (0.35) HMGCRSLCO1B1
SCHEMBL12212755 0.79 — —
SCHEMBL18256395 0.79 — —
SCHEMBL18253410 0.78 HMGCR (0.33) HMGCRSLCO1B1
SCHEMBL18845275 0.78 HMGCR (0.34) HMGCRSLCO1B1
SCHEMBL10049484 0.78 HMGCR (0.34) HMGCRSLCO1B1
SCHEMBL10224672 0.77 HMGCR (0.30) HMGCR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 — — US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 — — US disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 — — US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 — — US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 — — US disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 — — US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 — — US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 — — US disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 — — US disclosed
Send feedback