SCHEMBL12677516

SCHEMBL12677516

CCC(C)(CO)C(=O)OCCCN

nearest known ligand 0.36

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.36
CPB2 Q96IY4 1/20 0.33
PRKCA P17252 1/20 0.33
CYP4F2 P78329 3/20 0.32
CYP4A11 Q02928 3/20 0.32
ALDH1A1 P00352 1/20 0.31
ESR1 P03372 1/20 0.30
HTR2C P28335 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13829122 0.85 CYP4F2 (0.41) PRKCACYP4F2CYP4A11ALDH1A1
SCHEMBL862911 0.85 ALDH1A1 (0.47) CYP1A2ALDH1A1ESR1
SCHEMBL21138600 0.83 ALDH1A1 (0.37) CYP1A2ALDH1A1ESR1HTR2C
SCHEMBL12749187 0.81 CYP4F2 (0.36) CYP1A2CYP4F2CYP4A11
SCHEMBL2754861 0.81 GRM1 (0.36) PRKCACYP4F2CYP4A11ALDH1A1ESR1
SCHEMBL2754865 0.81 PRKCA (0.36) PRKCACYP4F2CYP4A11ALDH1A1
SCHEMBL20224650 0.80 HTR2C (0.40) ALDH1A1ESR1HTR2C
SCHEMBL12677515 0.79 CYP1A2 (0.39) CYP1A2CPB2CYP4F2CYP4A11ALDH1A1
SCHEMBL18101008 0.79 ALDH1A1 (0.33) CYP1A2CPB2ALDH1A1
SCHEMBL16174088 0.79 PRKCA (0.33) PRKCAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100243461-A1 METHOD OF FABRICATING CIRCUIT BOARD FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed