Fluoride

Fluoride

SCHEMBL127138

F.F.F.F.F.[As].[F-].c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.37
TSHR P16473 5/20 0.33
NOS3 P29474 2/20 0.33
NOS1 P29475 2/20 0.33
TDP1 Q9NUW8 4/20 0.32
CA1 P00915 2/20 0.32
CA2 P00918 2/20 0.32
CA9 Q16790 2/20 0.32
CA12 O43570 1/20 0.32
GLA P06280 1/20 0.32
CA3 P07451 1/20 0.32
CA4 P22748 1/20 0.32
CA14 Q9ULX7 1/20 0.32
LMNA P02545 1/20 0.32
ALOX12 P18054 1/20 0.32
ACHE P22303 1/20 0.32
CA7 P43166 1/20 0.32
HSD17B10 Q99714 2/20 0.30
MAPT P10636 1/20 0.30
HPGD P15428 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride SCHEMBL10437961 1.00 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride SCHEMBL4199304 0.97 ALDH1A1 (0.35) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride SCHEMBL127137 0.97 ALDH1A1 (0.35) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride SCHEMBL4199308 0.97 TSHR (0.38) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride SCHEMBL3281694 0.97 ALDH1A1 (0.35) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL10437963 0.96 ALDH1A1 (0.39) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL10907293 0.96 ALDH1A1 (0.39) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL126103 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL11224895 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1
Fluoride Ion SCHEMBL11224900 0.93 ALDH1A1 (0.37) ALDH1A1TSHRNOS3NOS1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024122416-A1 METHOD FOR PRODUCING LAMINATED BODY WITH HARD COAT LAYER 東亞合成株式会社 2024-06-13 WO disclosed
US-20240158904-A1 UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF TOAGOSEI CO., LTD. (JP) 2024-05-16 US disclosed
WO-2023238836-A1 SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL 東亞合成株式会社 2023-12-14 WO disclosed
EP-4289618-A1 UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME Toagosei Co., Ltd. (JP) 2023-12-13 EP disclosed
CN-116897195-A Primer composition for inorganic substance layer lamination, cured product thereof, and method for producing same 东亚合成株式会社 2023-10-17 CN disclosed
WO-2023128264-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY APPARATUS 주식회사 동진쎄미켐 2023-07-06 WO disclosed
CN-108781489-B Sealing agent for organic electroluminescent display element 积水化学工业株式会社 2023-02-07 CN disclosed
CN-115220303-A Photosensitive resin composition and display device comprising same 株式会社东进世美肯 2022-10-21 CN disclosed
CN-114716648-A Sealing agent for organic electroluminescent display element 积水化学工业株式会社 2022-07-08 CN disclosed
US-20220186066-A1 PROTECTION MEMBER FOR SEMICONDUCTOR, PROTECTION COMPOSITION FOR INKJET COATING-TYPE SEMICONDUCTOR, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS USING SAME, AND SEMICONDUCTOR APPARATUS MITSUI CHEMICALS, INC. (JP) 2022-06-16 US disclosed
US-20070037896-A1 polymerizable resin composition comprises an epoxy compound, a photo cation polymerization initiator, and a photo radical polymerization initiator; excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage; surface protective material for optical disks MITSUI CHEMICALS, INC. (JP) 2007-02-15 US disclosed
WO-2006033438-A1 RADICALLY POLYMERIZABLE SULFUR-CONTAINING COMPOUND AND RADICALLY POLYMERIZABLE SULFUR-CONTAINING POLYMER SHOWA DENKO K.K. (JP) 2006-03-30 WO disclosed
EP-1630189-A1 CATIONICALLY PHOTOPOLYMERIZABLE RESIN COMPOSITION AND OPTICAL DISK SURFACE PROTECTION MATERIAL Mitsui Chemicals, Inc. (JP) 2006-03-01 EP disclosed
US-6395340-B1 THERMOSETTING PAINT KANSAI PAINT CO., LTD. (JP) 2002-05-28 US disclosed
EP-1038935-A1 COATING COMPOSITION AND METHOD FOR COATING THEREWITH KANSAI PAINT CO., LTD. (JP) 2000-09-27 EP disclosed
EP-1026211-A1 COATING COMPOSITION AND METHOD FOR APPLYING THE SAME KANSAI PAINT CO., LTD. (JP) 2000-08-09 EP disclosed
EP-0687697-B1 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEM (JP) 2000-05-03 EP disclosed
US-5733982-A CURABLE COMPOSITIONS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1998-03-31 US disclosed
US-5556927-A FILMS, COATINGS, REACTION OF EPOXY RESIN OR LACTONE MODIFIED EPOXY RESIN WITH CYCLIC CARBONATE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-17 US disclosed
EP-0687697-A2 A carbonate group-modified epoxy resin and thermosetting compositions of resins containing hydroxyalkyl carbonate groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1995-12-20 EP disclosed