SCHEMBL1277684

SCHEMBL1277684

CCCCN(C(C)=O)[Si](C)(N(CCCC)C(C)=O)N(CCCC)C(C)=O

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.40
CA1 P00915 2/20 0.40
CA9 Q16790 2/20 0.40
MMP1 P03956 1/20 0.38
MMP2 P08253 1/20 0.38
MMP3 P08254 1/20 0.38
MMP8 P22894 1/20 0.38
ELANE P08246 1/20 0.35
CES1 P23141 6/20 0.34
CES2 O00748 5/20 0.33
ALDH1A1 P00352 4/20 0.33
MLYCD O95822 1/20 0.32
ALDH2 P05091 1/20 0.31
ATM Q13315 1/20 0.31
AKR1B1 P15121 1/20 0.31
TP53 P04637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11066762 0.86 CA12 (0.43) CA12CA1CA9MMP1MMP2
SCHEMBL508319 0.78 CA12 (0.34) CA12CA1CA9MMP1MMP2
SCHEMBL5253602 0.76 CA12 (0.43) CA12CA1CA9MMP1MMP2
SCHEMBL9422287 0.75 CHRM1 (0.33) ALDH1A1
SCHEMBL28790113 0.71 CA12 (0.36) CA12CA9ALDH1A1TP53
SCHEMBL3310787 0.71 ALDH1A1 (0.41) CA12CA1CA9MMP1MMP2
SCHEMBL2123995 0.70 CA12 (0.46) CA12CA1CA9MMP1MMP2
SCHEMBL497913 0.70 CA12 (0.58) CA12CA1CA9MMP1MMP2
SCHEMBL28169703 0.70 CES1 (0.32) CA12CA1CA9CES1CES2
Hydrochloric Acid SCHEMBL3023639 0.69 CA12 (0.56) CA12CA1CA9MMP1MMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4620585-A1 DISASSEMBLY METHOD FOR BONDED MEMBER AND EASILY-DISASSEMBLED SILICONE-BASED LIQUID ADHESIVE AGENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-09-24 EP disclosed
US-20240409777-A1 METHOD FOR DISMANTLING BONDED MEMBER, BONDED MEMBER, AND EASILY DISMANTLED SILICONE-BASED LIQUID ADHESIVE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-12-12 US disclosed
EP-4410921-A1 METHOD FOR DISMANTLING BONDED MEMBER, BONDED MEMBER, AND EASILY DISMANTLED SILICONE-BASED LIQUID ADHESIVE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-07 EP disclosed
WO-2024106077-A1 DISASSEMBLY METHOD FOR BONDED MEMBER AND EASILY-DISASSEMBLED SILICONE-BASED LIQUID ADHESIVE AGENT 信越化学工業株式会社 2024-05-23 WO disclosed
CN-117980432-A Method for disassembling joint member, and easily-detachable liquid silicone adhesive 信越化学工业株式会社 2024-05-03 CN disclosed
EP-3467044-B1 THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHINETSU CHEMICAL CO (JP) 2024-04-24 EP disclosed
EP-3530702-B1 THERMOCONDUCTIVE SILICONE COMPOSITION SHINETSU CHEMICAL CO (JP) 2024-02-21 EP disclosed
WO-2023054052-A1 METHOD FOR DISMANTLING BONDED MEMBER, BONDED MEMBER, AND EASILY DISMANTLED SILICONE-BASED LIQUID ADHESIVE 信越化学工業株式会社 2023-04-06 WO disclosed
CN-109844030-B Heat conductive silicone composition 信越化学工业株式会社 2022-04-26 CN disclosed
US-11248154-B2 Thermoconductive silicone composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-02-15 US disclosed
EP-2439241-B1 Moisture-thickening heat-conductive silicone grease composition SHINETSU CHEMICAL CO (JP) 2013-04-03 EP disclosed
US-20120085964-A1 MOISTURE-THICKENING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2012-04-12 US disclosed
US-5708076-A SELF-EXTINGUISHING SILICONE RUBBER, ALUMINUM HYDROXIDE AND CALCIUM CARBONATE FILLERS DOW CORNING TORAY SILICONE CO., LTD. (JP) 1998-01-13 US disclosed
EP-0483776-B1 Room temperature-curable organopolysiloxane composition DOW CORNING TORAY SILICONE (JP) 1997-05-02 EP disclosed
EP-0488204-B1 Room Temperature-curable organopolysiloxane composition DOW CORNING TORAY SILICONE (JP) 1996-04-24 EP disclosed
EP-0488204-A2 Room Temperature-curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1992-06-03 EP disclosed
EP-0483776-A2 Room temperature-curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1992-05-06 EP disclosed
EP-0050453-B1 AN OIL-RESISTANT GASKET MATERIAL AND PACKING MATERIAL Toray Silicone Company Limited (JP) 1985-04-24 EP disclosed
EP-0050453-A1 An oil-resistant gasket material and packing material Toray Silicone Company Limited (JP) 1982-04-28 EP disclosed
US-4156674-A PLATINUM OR COMPOUND THEREOF, CARBON BLACK AND A TRIAZOLE FOR SELF-EXTINGUISHING CHARACTER, CURING CATALYST AND A SILICON CONTAINING CROSSLINKER TORAY SILICONE COMPANY, LTD. (JP) 1979-05-29 US disclosed