Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 3/20 | 0.47 |
| ▸ | HTT | P42858 | 3/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.47 |
| ▸ | APEX1 | P27695 | 1/20 | 0.47 |
| ▸ | AR | P10275 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 8/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.42 |
| ▸ | MEN1 | O00255 | 4/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.41 |
| ▸ | NPC1 | O15118 | 1/20 | 0.40 |
| ▸ | RAB9A | P51151 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 2/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | PPARG | P37231 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5228296 | 0.94 | AR (0.43) | POLBHTTTDP1APEX1AR | |
| SCHEMBL2158767 | 0.94 | KDM4E (0.51) | POLBHTTTDP1APEX1KDM4E | |
| SCHEMBL14030018 | 0.93 | POLB (0.51) | POLBHTTTDP1APEX1AR | |
| SCHEMBL14173142 | 0.86 | POLB (0.56) | POLBHTTTDP1APEX1AR | |
| SCHEMBL59813 | 0.86 | POLB (0.56) | POLBHTTTDP1APEX1AR | |
| SCHEMBL346370 | 0.85 | POLB (0.62) | POLBHTTTDP1APEX1KDM4E | |
| Propane SCHEMBL9476274 | 0.84 | HTT (0.53) | POLBHTTTDP1APEX1AR | |
| SCHEMBL29981767 | 0.84 | HTT (0.68) | POLBHTTTDP1APEX1KDM4E | |
| SCHEMBL31265922 | 0.84 | HTT (0.68) | POLBHTTTDP1APEX1KDM4E | |
| SCHEMBL15084281 | 0.84 | HTT (0.68) | POLBHTTTDP1APEX1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024147200-A1 | ADHESIVE FILM AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-11 | — | — | WO | disclosed |
| WO-2024135442-A1 | POLYMERIZABLE COMPOSITION | 株式会社レゾナック | 2024-06-27 | — | — | WO | disclosed |
| WO-2024106337-A1 | POLYMERIZABLE COMPOSITION | 株式会社レゾナック | 2024-05-23 | — | — | WO | disclosed |
| WO-2024058218-A1 | ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM, CONNECTION STRUCTURE BODY, AND METHOD FOR MANUFACTURING SAME | 株式会社レゾナック | 2024-03-21 | — | — | WO | disclosed |
| WO-2024058130-A1 | POLYMERIZABLE COMPOSITION | 株式会社レゾナック | 2024-03-21 | — | — | WO | disclosed |
| WO-2024048088-A1 | ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | デクセリアルズ株式会社 | 2024-03-07 | — | — | WO | disclosed |
| US-11887748-B2 | Adhesive composition and coupling structure | RESONAC CORPORATION (JP) | 2024-01-30 | — | — | US | disclosed |
| WO-2023195398-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD OF PRODUCING SAME | 株式会社レゾナック | 2023-10-12 | — | — | WO | disclosed |
| US-20230146296-A1 | ADHESIVE COMPOSITION AND COUPLING STRUCTURE | RESONAC CORPORATION (JP) | 2023-05-11 | — | — | US | disclosed |
| WO-2023276889-A1 | ADHESIVE FILM FOR CONNECTING CIRCUIT, CIRCUIT CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME | 昭和電工マテリアルズ株式会社 | 2023-01-05 | — | — | WO | disclosed |
| EP-2040268-A1 | CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2009-03-25 | — | — | EP | disclosed |
| WO-2008110342-A1 | SECURITY DEVICE WITH MULTIPLE AUTHENTICATION FEATURES | TECHNISCHE UNIVERSITEIT EINDHOVEN (NL) | 2008-09-18 | — | — | WO | disclosed |
| EP-1967564-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-09-10 | — | — | EP | disclosed |
| EP-1528435-B1 | Method for forming images | FUJIFILM CORP (JP) | 2008-06-25 | — | — | EP | disclosed |
| US-7125648-B2 | Method for forming images | FUJI PHOTO FILM CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| US-7115352-B2 | Method for forming images | FUJI PHOTO FILM CO., LTD. (JP) | 2006-10-03 | — | — | US | disclosed |
| EP-1553455-A2 | Method for forming images | Fuji Photo Film Co., Ltd. (JP) | 2005-07-13 | — | — | EP | disclosed |
| US-20050136362-A1 | Method for forming images | FUJI PHOTO FILM CO., LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| US-20050112496-A1 | Method for forming images | FUJI PHOTO FILM CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| EP-1528435-A1 | Method for forming images | FUJI PHOTO FILM CO., LTD. (JP) | 2005-05-04 | — | — | EP | disclosed |