Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.41 |
| ▸ | IDO1 | P14902 | 2/20 | 0.41 |
| ▸ | SIGMAR1 | Q99720 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | PAM | P19021 | 1/20 | 0.37 |
| ▸ | HTR2A | P28223 | 3/20 | 0.35 |
| ▸ | RELA | Q04206 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL886961 | 0.90 | IDO1 (0.46) | IDO1SIGMAR1MEN1KMT2APAM | |
| SCHEMBL7110889 | 0.89 | IDO1 (0.48) | HRH3IDO1SIGMAR1MEN1KMT2A | |
| SCHEMBL10889742 | 0.89 | IDO1 (0.48) | HRH3IDO1SIGMAR1MEN1KMT2A | |
| SCHEMBL886955 | 0.84 | IDO1 (0.44) | IDO1SIGMAR1MEN1KMT2APAM | |
| SCHEMBL1470885 | 0.82 | IDO1 (0.48) | IDO1SIGMAR1MEN1KMT2APAM | |
| SCHEMBL28827810 | 0.81 | IDO1 (0.53) | IDO1SIGMAR1MEN1KMT2APAM | |
| SCHEMBL10776841 | 0.78 | TSHR (0.47) | HRH3IDO1SIGMAR1HTR2A | |
| SCHEMBL10776843 | 0.78 | TSHR (0.47) | HRH3IDO1SIGMAR1HTR2A | |
| SCHEMBL7108908 | 0.78 | IDO1 (0.52) | HRH3IDO1SIGMAR1MEN1KMT2A | |
| SCHEMBL7108904 | 0.78 | IDO1 (0.52) | HRH3IDO1SIGMAR1MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114940675-B | Compound, preparation method thereof, resin prepared by using compound and low-temperature curing resin composition | 波米科技有限公司 | 2023-05-02 | — | — | CN | disclosed |
| CN-110333647-B | Positive photosensitive resin composition | 波米科技有限公司 | 2023-04-14 | — | — | CN | disclosed |
| CN-114940675-A | Compound, preparation method thereof, resin prepared from compound and low-temperature curing resin composition | 波米科技有限公司 | 2022-08-26 | — | — | CN | disclosed |
| CN-114895527-A | Positive photosensitive resin precursor composition, preparation method and application thereof | 南通晶爱微电子科技有限公司 | 2022-08-12 | — | — | CN | disclosed |
| EP-2520977-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-11-22 | — | — | EP | disclosed |
| US-8883391-B2 | Positive type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2014-11-11 | — | — | US | disclosed |
| EP-2520977-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2012-11-07 | — | — | EP | disclosed |
| US-20120251949-A1 | POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2012-10-04 | — | — | US | disclosed |