SCHEMBL12802438

SCHEMBL12802438

COC(C)O[SiH2]CCC=Cc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 3/20 0.42
SIGMAR1 Q99720 2/20 0.42
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
IDO1 P14902 2/20 0.38
KDM4E B2RXH2 2/20 0.37
ALDH1A1 P00352 2/20 0.37
MAPT P10636 2/20 0.37
RECQL P46063 1/20 0.37
TP53 P04637 1/20 0.37
CYP3A4 P08684 1/20 0.37
ALOX15 P16050 1/20 0.37
PPARD Q03181 1/20 0.35
PPARA Q07869 1/20 0.35
TRPA1 O75762 1/20 0.35
PAM P19021 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12802637 0.84 HTR2A (0.45) HTR2ASIGMAR1MEN1KMT2AIDO1
SCHEMBL886963 0.80 SIGMAR1 (0.45) HTR2ASIGMAR1MEN1KMT2AIDO1
SCHEMBL886957 0.74 RELA (0.43) HTR2ASIGMAR1MEN1KMT2AIDO1
SCHEMBL3811390 0.72 SIGMAR1 (0.36) SIGMAR1
SCHEMBL11700536 0.70 HTR2A (0.46) HTR2ASIGMAR1MEN1KMT2AIDO1
SCHEMBL11700540 0.70 HTR2A (0.46) HTR2ASIGMAR1MEN1KMT2AIDO1
SCHEMBL2398143 0.69 HTR2A (0.45) HTR2ASIGMAR1MEN1KMT2AIDO1
SCHEMBL3815810 0.68 TAAR1 (0.36) SIGMAR1MEN1KMT2ATP53TRPA1
SCHEMBL7568412 0.68 IDO1 (0.56) HTR2ASIGMAR1IDO1ALDH1A1TRPA1
SCHEMBL7939387 0.68 IDO1 (0.56) HTR2ASIGMAR1IDO1ALDH1A1TRPA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114940675-B Compound, preparation method thereof, resin prepared by using compound and low-temperature curing resin composition 波米科技有限公司 2023-05-02 CN disclosed
CN-110333647-B Positive photosensitive resin composition 波米科技有限公司 2023-04-14 CN disclosed
CN-114940675-A Compound, preparation method thereof, resin prepared from compound and low-temperature curing resin composition 波米科技有限公司 2022-08-26 CN disclosed
CN-114895527-A Positive photosensitive resin precursor composition, preparation method and application thereof 南通晶爱微电子科技有限公司 2022-08-12 CN disclosed
EP-2520977-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-11-22 EP disclosed
US-8883391-B2 Positive type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2014-11-11 US disclosed
EP-2520977-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION Toray Industries, Inc. (JP) 2012-11-07 EP disclosed
US-20120251949-A1 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2012-10-04 US disclosed