SCHEMBL12807367

SCHEMBL12807367

COC(C)C(=O)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29183039 0.79 FAAH (0.41)
SCHEMBL24568193 0.76 TSHR (0.32)
SCHEMBL24568622 0.76 TSHR (0.32)
SCHEMBL3902508 0.74 ALDH1A1 (0.33)
SCHEMBL8090957 0.74 SLC1A3 (0.39)
SCHEMBL16405045 0.74 SLC1A3 (0.39)
SCHEMBL7127933 0.74 SLC1A3 (0.39)
SCHEMBL24597251 0.74 ESR1 (0.30)
SCHEMBL21993869 0.74 SLC1A3 (0.34)
SCHEMBL12237506 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 150 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117003664-A Method for preparing N, N-dimethylacrylamide by low-temperature pyrolysis 辽宁海特新材料有限公司 2023-11-07 CN claimed
EP-3349887-B1 PROCESS FOR MAKING MEMBRANES USING LACTAMIDE BASED SOLVENTS BASF SE (DE) 2022-07-20 EP claimed
US-20180257044-A1 PROCESS FOR MAKING MEMBRANES BASF SE (DE) 2018-09-13 US claimed
EP-3349887-A1 PROCESS FOR MAKING MEMBRANES USING LACTAM IDE BASED SOLVENTS BASF SE (DE) 2018-07-25 EP claimed
EP-4674515-A1 POLYMER SOLUTIONS FOR THE PREPARATION OF POLYMER MEMBRANES Elantas GmbH (DE) 2026-01-07 EP disclosed
US-12518889-B2 Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body NAMICS CORPORATION (JP) 2026-01-06 US disclosed
EP-4660705-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN USING SAME, CURED ARTICLE AND ELECTRONIC COMPONENT Toray Industries, Inc. (JP) 2025-12-10 EP disclosed
US-20250321481-A1 PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-10-16 US disclosed
US-20250189891-A1 POLYIMIDE RESIN PRECURSOR TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
CN-120077502-A Electrolyte, electrochemical device, secondary battery, and lithium ion secondary battery 大金工业株式会社 2025-05-30 CN disclosed
CN-120051874-A Binder for positive electrode, electrode mixture, electrode, and secondary battery 大金工业株式会社 2025-05-27 CN disclosed
CN-115685681-B Resin composition, resin film and display device 吉林奥来德光电材料股份有限公司 2025-05-20 CN disclosed
EP-2796518-A1 Process for producing decorative sheet, decorative sheet, decorative sheet molded product, process for producing in-mold molded article, and in-mold molded article Fujifilm Corporation (JP) 2014-10-29 EP disclosed
US-20140287206-A1 WHITE INK COMPOSITION, INK SET FOR FORMING MULTIPLE LAYERS, IMAGE FORMING METHOD AND PRINTED MATTER FUJIFILM CORPORATION (JP) 2014-09-25 US disclosed
EP-2781565-A1 White ink composition, ink set for forming multiple layers, image forming method and printed matter Fujifilm Corporation (JP) 2014-09-24 EP disclosed
US-20140248473-A1 PROCESS FOR PRODUCING DECORATIVE SHEET, DECORATIVE SHEET, DECORATIVE SHEET MOLDED PRODUCT, PROCESS FOR PRODUCING IN-MOLD MOLDED ARTICLE, AND IN-MOLD MOLDED ARTICLE FUJIFILM CORPORATION (JP) 2014-09-04 US disclosed
US-20130257034-A1 INK COMPOSITION, IMAGE FORMING METHOD, AND PRINTED ARTICLE FUJIFILM CORPORATION (JP) 2013-10-03 US disclosed
EP-2644404-A2 INK COMPOSITION, IMAGE FORMING METHOD, AND PRINTED ARTICLE FUJIFILM Corporation (JP) 2013-10-02 EP disclosed
US-20120302791-A1 ETHER-AMIDE COMPOUNDS AND USES THEREOF SPECIALTY OPERATIONS FRANCE (FR) 2012-11-29 US disclosed
WO-2011048314-A1 ETHER-AMIDE COMPOUNDS AND USES THEREOF RHODIA OPERATIONS (FR) 2011-04-28 WO disclosed