SCHEMBL12852155

SCHEMBL12852155

CCOCCSCCSCCOCC

nearest known ligand 0.43

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.43
TSHR P16473 1/20 0.35
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
CYP3A4 P08684 1/20 0.30
HSD17B10 Q99714 1/20 0.30
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7546724 0.97 ALDH1A1 (0.45) ALDH1A1TSHRMEN1KMT2ATDP1
SCHEMBL7101023 0.94 ALDH1A1 (0.43) ALDH1A1TSHRMEN1KMT2ATDP1
SCHEMBL11313394 0.85
SCHEMBL9077135 0.85 ALDH1A1 (0.41) ALDH1A1TSHRMEN1KMT2ATDP1
SCHEMBL14268280 0.84
SCHEMBL10950512 0.84 CES1 (0.38) ALDH1A1TSHRMEN1KMT2ATDP1
SCHEMBL10884319 0.84
SCHEMBL17715092 0.84 ALDH1A1 (0.36) ALDH1A1TSHRMEN1KMT2ATDP1
SCHEMBL16948464 0.82 ALDH1A1 (0.35) ALDH1A1TSHRMEN1KMT2ATDP1
SCHEMBL6476012 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2145765-B1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving. relief printing plate, and method of producing relief printing plate FUJIFILM CORP (JP) 2016-12-07 EP disclosed
US-8367300-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of producing relief printing plate FUJIFILM CORPORATION (JP) 2013-02-05 US disclosed
US-8367300-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of producing relief printing plate FUJIFILM CORPORATION (JP) 2013-02-05 US disclosed
EP-2168764-B1 Relief printing plate precursor for laser engraving, method of producing the same and method of producing relief printing plate FUJIFILM CORP (JP) 2012-10-31 EP disclosed
US-8278387-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
US-8278387-B2 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2012-10-02 US disclosed
EP-2168764-A2 Relief printing plate precursor for laser engraving, method of producing the same, relief printing plate obtainable therefrom, and method of producing relief printing plate FUJIFILM Corporation (JP) 2010-03-31 EP disclosed
US-20100075117-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, METHOD OF PRODUCING THE SAME, RELIEF PRINTING PLATE OBTAINABLE THEREFROM, AND METHOD OF PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100075117-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, METHOD OF PRODUCING THE SAME, RELIEF PRINTING PLATE OBTAINABLE THEREFROM, AND METHOD OF PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100015416-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-01-21 US disclosed
US-20100015416-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-01-21 US disclosed
EP-2145765-A1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving. relief printing plate, and method of producing relief printing plate FUJIFILM Corporation (JP) 2010-01-20 EP disclosed
EP-2135739-A2 Relief printing plate precursor for laser engraving, relief printing plate, and process for producing relief printing plate FUJIFILM Corporation (JP) 2009-12-23 EP disclosed
US-20090311494-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND PROCESS FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-12-17 US disclosed
US-20090311494-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND PROCESS FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-12-17 US disclosed
US-20090246469-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-20090246469-A1 RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
EP-2105795-A1 Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM Corporation (JP) 2009-09-30 EP disclosed