SCHEMBL1298690

SCHEMBL1298690

COCCOC[C](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1925455 0.86
SCHEMBL21962233 0.82
SCHEMBL13498373 0.80
SCHEMBL805276 0.80
SCHEMBL26073721 0.80
Ethane SCHEMBL28144942 0.79 CA2 (0.42)
SCHEMBL5498275 0.79
SCHEMBL18467770 0.78 CES2 (0.50)
SCHEMBL12541324 0.78 CA2 (0.32)
SCHEMBL29994373 0.78 CES2 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11618762-B2 Compound, raw material for forming thin film, method for manufacturing thin film, and amidine compound ADEKA CORPORATION (JP) 2023-04-04 US disclosed
CN-107428677-B Diazadienyl compound, raw material for forming thin film, method for producing thin film, and diazadiene compound 株式会社ADEKA 2022-04-05 CN disclosed
CN-109923119-B Compound, raw material for forming thin film, method for producing thin film, and amidine compound 株式会社ADEKA 2022-03-18 CN disclosed
CN-109715601-B Diazadienyl compound, raw material for forming thin film, and method for producing thin film 株式会社ADEKA 2022-02-25 CN disclosed
US-20220017554-A1 COMPOUND, RAW MATERIAL FOR FORMING THIN FILM, METHOD FOR MANUFACTURING THIN FILM, AND AMIDINE COMPOUND ADEKA CORPORATION (JP) 2022-01-20 US disclosed
US-11161867-B2 Compound, raw material for forming thin film, method for manufacturing thin film, and amidine compound ADEKA CORPORATION (JP) 2021-11-02 US disclosed
EP-3505511-B1 DIAZADIENYL COMPOUND, RAW MATERIAL FOR FORMING THIN FILM, AND METHOD FOR PRODUCING THIN FILM ADEKA CORP (JP) 2021-05-26 EP disclosed
CN-109154080-B Raw material for forming thin film and method for producing thin film 株式会社ADEKA 2021-05-11 CN disclosed
US-10927460-B2 Raw material for forming thin film, and method for manufacturing thin film ADEKA CORPORATION (JP) 2021-02-23 US disclosed
US-10920313-B2 Diazadienyl compound, raw material for forming thin film, and method for manufacturing thin film ADEKA CORPORATION (JP) 2021-02-16 US disclosed
EP-1242327-B1 PIGMENTED VITREOUS MATERIAL ITS PRECURSOR GLASS ITEMS COATED THEREWITH AND METHOD OF ITS PREPARATION CIBA SC HOLDING AG (CH) 2004-03-31 EP disclosed
EP-1400496-A1 Pigment precursors for making pigmented vitreous material Ciba SC Holding AG (CH) 2004-03-24 EP disclosed
US-20030140820-A1 Pigmented vitreous material BUJARD PATRICE (CH) 2003-07-31 US disclosed
US-20030124251-A1 Process of forming thin film and precursor for chemical vapor deposition ASAHI DENKA CO., LTD. (JP) 2003-07-03 US disclosed
CN-1420203-A Method for mfg. thin film and feedstock for chemical vapor growth ASANI DENKA KOGYO K K (JP) 2003-05-28 CN disclosed
US-6547863-B2 Having stability and concentration fit for solution chemical vapor deposition by utilizing cyclohexane based compounds which disolve said metal compound ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2003-04-15 US disclosed
US-6524382-B1 Crosslinking organic pigment or chromophore with transition metal compound CIBA SPECIALTY CHEMICALS CORPORATION 2003-02-25 US disclosed
EP-1242327-A1 PIGMENTED VITREOUS MATERIAL ITS PRECURSOR GLASS ITEMS COATED THEREWITH AND METHOD OF ITS PREPARATION Ciba SC Holding AG (CH) 2002-09-25 EP disclosed
US-20010022148-A1 Metal compound solution and thin film formation using the same ASAHI DENKA KOGYO KABUSHIKI KAISHA 2001-09-20 US disclosed
WO-2001032577-A1 PIGMENTED VITREOUS MATERIAL ITS PRECURSOR GLASS ITEMS COATED THEREWITH AND METHOD OF ITS PREPARATION CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 2001-05-10 WO disclosed