SCHEMBL13027232

SCHEMBL13027232

CO[Si](Cc1ccccc1C)(OC)OC

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TAAR1 Q96RJ0 1/20 0.43
TSHR P16473 2/20 0.39
CYP11B1 P15538 2/20 0.38
CYP11B2 P19099 2/20 0.38
LMNA P02545 1/20 0.38
ADRA2A P08913 1/20 0.38
ADRA2B P18089 1/20 0.38
ADRA2C P18825 1/20 0.38
ACHE P22303 1/20 0.38
CHRM2 P08172 2/20 0.37
PTGS1 P23219 1/20 0.37
PTGS2 P35354 1/20 0.37
KMT2A Q03164 2/20 0.36
NPC1 O15118 1/20 0.36
GALR3 O60755 1/20 0.36
NR2F2 P24468 1/20 0.36
RAB9A P51151 1/20 0.36
CYP2A13 Q16696 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
MEN1 O00255 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL83268 0.86 IDO1 (0.35) TAAR1CHRM2SMN1; SMN2GAA
SCHEMBL13027234 0.83 ESR1 (0.39) TAAR1TSHRKMT2AMEN1GAA
SCHEMBL13027252 0.80 SCN8A (0.37) TSHRLMNAGAA
SCHEMBL2203418 0.79 TAAR1 (0.50) TAAR1TSHRCYP11B1CYP11B2LMNA
SCHEMBL8142412 0.79 TAAR1 (0.41) TAAR1TSHRCYP11B1CYP11B2ADRA2A
SCHEMBL13027730 0.79 SCN8A (0.31) TSHRLMNA
SCHEMBL20994309 0.77 IDO1 (0.40) TAAR1
SCHEMBL22661051 0.77 HSPA5 (0.48) TAAR1TSHR
SCHEMBL1972978 0.77 IDO1 (0.52) TAAR1LMNAACHECHRM2KMT2A
SCHEMBL13027226 0.76 TAAR1 (0.36) TAAR1TSHRLMNAACHEKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11692093-B2 Resin composition, method for producing three-dimensional molding using same, and three-dimensional molding Konica Minolta, Inc. (JP) 2023-07-04 US disclosed
US-20200263023-A1 RESIN COMPOSITION, METHOD FOR PRODUCING THREE-DIMENSIONAL MOLDING USING SAME, AND THREE-DIMENSIONAL MOLDING Konica Minolta, Inc. (JP) 2020-08-20 US disclosed
US-8697330-B2 Composition for forming a silicon-containing antireflection film, substrate having the silicon-containing antireflection film from the composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-04-15 US disclosed
US-20100285407-A1 Composition for forming a silicon-containing antireflection film, substrate having the silicon-containing antireflection film from the composition and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-11-11 US disclosed