SCHEMBL83268

SCHEMBL83268

CO[Si](Cc1ccccc1C[Si](OC)(OC)OC)(OC)OC

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 2/20 0.35
TAAR1 Q96RJ0 1/20 0.35
CHRM2 P08172 2/20 0.34
CHRM1 P11229 1/20 0.34
ALDH1A1 P00352 3/20 0.33
GAA P10253 2/20 0.33
CA4 P22748 2/20 0.33
MAPT P10636 1/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
CA7 P43166 1/20 0.33
CA9 Q16790 1/20 0.33
CA14 Q9ULX7 1/20 0.33
KDM1A O60341 1/20 0.33
HSD17B10 Q99714 1/20 0.33
RCOR1 Q9UKL0 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2C19 P33261 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20994309 0.89 IDO1 (0.40) IDO1TAAR1
SCHEMBL13027232 0.86 TAAR1 (0.43) TAAR1CHRM2GAASMN1; SMN2
SCHEMBL22661051 0.84 HSPA5 (0.48) IDO1TAAR1CA12CA1CA2
SCHEMBL1972978 0.84 IDO1 (0.52) IDO1TAAR1CHRM2CHRM1ALDH1A1
SCHEMBL13027853 0.83 MGAM (0.37)
SCHEMBL6062060 0.83 BPTF (0.37) ALDH1A1GAAMAPTL3MBTL1KDM4E
SCHEMBL29975538 0.81 CYP1A2 (0.48) ALDH1A1L3MBTL1CYP1A2CYP2C19ATM
SCHEMBL27094920 0.81 DPP4 (0.48) CA12CA1CA2CA7CA9
SCHEMBL2817986 0.81 CYP1A2 (0.48) ALDH1A1L3MBTL1CYP1A2CYP2C19ATM
SCHEMBL1968488 0.80 L3MBTL1 (0.53) ALDH1A1GAAMAPTL3MBTL1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110446758-A expandable silica particles UNILEVER PLC 2019-11-12 CN claimed
CN-109923197-A Laundry treatment compositions comprising fragrance and silicon dioxide microparticle 荷兰联合利华有限公司 2019-06-21 CN claimed
US-8481423-B2 Methods to mitigate plasma damage in organosilicate dielectrics INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-07-09 US claimed
US-8128993-B2 Anisotropic nanotube fabric layers and films and methods of forming same NANTERO INC. (US) 2012-03-06 US claimed
US-8039049-B2 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2011-10-18 US claimed
US-20090075472-A1 METHODS TO MITIGATE PLASMA DAMAGE IN ORGANOSILICATE DIELECTRICS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-03-19 US claimed
US-7405168-B2 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMITED (JP) 2008-07-29 US claimed
US-20080076262-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2008-03-27 US claimed
US-7345000-B2 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2008-03-18 US claimed
WO-2007040834-A2 PLURAL TREATMENT STEP PROCESS FOR TREATING DIELECTRIC FILMS TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
WO-2007040856-A2 PLASMA-ASSISTED VAPOR PHASE TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
WO-2007040816-A2 TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
US-20070077353-A1 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077781-A1 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMTED (JP) 2007-04-05 US claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070059211-A1 TNT sensor containing molecularly imprinted sol gel-derived films THE COLLEGE OF WOOSTER (US) 2007-03-15 US claimed
WO-2006091264-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2006-08-31 WO claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
EP-4569015-A1 BIOCOMPATIBLE OXYGEN-SENSITIVE MATERIALS Promega Corporation (US) 2025-06-18 EP disclosed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US disclosed