⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1306065 | 1.00 | — | — | |
| SCHEMBL11833356 | 0.70 | — | — | |
| SCHEMBL11833363 | 0.70 | — | — | |
| SCHEMBL1305263 | 0.69 | — | — | |
| SCHEMBL19393827 | 0.66 | — | — | |
| SCHEMBL10942770 | 0.63 | ALDH1A1 (0.43) | — | |
| SCHEMBL18904221 | 0.63 | — | — | |
| SCHEMBL10772535 | 0.63 | — | — | |
| SCHEMBL18519507 | 0.63 | — | — | |
| SCHEMBL21065790 | 0.62 | ALOX15 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7012120-B2 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | HENKEL CORPORATION (US) | 2006-03-14 | — | — | US | claimed |
| US-20050288458-A1 | Reworkable thermosetting resin composition | KLEMARCZYK PHILIP T | 2005-12-29 | — | — | US | claimed |
| US-20030073770-A1 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | Henkel IP & Holding GmbH (DE) | 2003-04-17 | — | — | US | claimed |
| US-8053587-B2 | for mounting onto a circuit board semiconductor devices | HENKEL CORPORATION (US) | 2011-11-08 | — | — | US | disclosed |
| US-20080214840-A1 | Reworkable thermosetting resin composition | HENKEL CORPORATION (US) | 2008-09-04 | — | — | US | disclosed |
| US-7012120-B2 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | HENKEL CORPORATION (US) | 2006-03-14 | — | — | US | disclosed |
| US-20050288458-A1 | Reworkable thermosetting resin composition | KLEMARCZYK PHILIP T | 2005-12-29 | — | — | US | disclosed |
| EP-1268457-A4 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORP (US) | 2005-07-20 | — | — | EP | disclosed |
| US-20030073770-A1 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | Henkel IP & Holding GmbH (DE) | 2003-04-17 | — | — | US | disclosed |
| EP-1268457-A1 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2003-01-02 | — | — | EP | disclosed |
| WO-2001074798-A1 | REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT | LOCTITE CORPORATION (US) | 2001-10-11 | — | — | WO | disclosed |