SCHEMBL13061517

SCHEMBL13061517

CCC(C)(C)CC1(C(=O)OC2CCOC2=O)CC1(C)C

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.43
ALDH1A1 P00352 2/20 0.43
HPGD P15428 1/20 0.43
HSD17B10 Q99714 1/20 0.43
POLB P06746 2/20 0.38
MAPK1 P28482 4/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2C9 P11712 1/20 0.37
CYP2C19 P33261 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
GAA P10253 1/20 0.36
TSHR P16473 2/20 0.34
NTSR1 P30989 1/20 0.33
ATM Q13315 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14215563 0.91 KDM4E (0.41) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL12250184 0.89 KDM4E (0.43) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL9923986 0.74 TSHR (0.31) HSD17B10TSHR
SCHEMBL14099241 0.72 KDM4E (0.42) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL12973914 0.72 KDM4E (0.48) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL47499 0.72 ALDH1A1 (0.48) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL10191599 0.71 KDM4E (0.43) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL10075015 0.71 KDM4E (0.43) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL13061703 0.71 KDM4E (0.45) KDM4EALDH1A1HPGDHSD17B10POLB
SCHEMBL26453016 0.71 KDM4E (0.47) KDM4EALDH1A1HPGDHSD17B10POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7851127-B2 Polymer compound, positive resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2010-12-14 US disclosed
US-20090162784-A1 POLYMER COMPOUND, POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-25 US disclosed